AVACO

• Multi-purpose ultra-purity metal films manufacturing system by strictly controlling the film properties such as logic, memory application & advanced package in semiconductors
• A flexible system for mixing and matching chambers to apply multi-step process sequence
• Demonstrates high reliability and provides more CoO benefits
• Feature & Properties

       · Wafer size : 12” (300mm) & 8” (200mm) (6”available)
       · Proven platform reliability as tandem/single transfer and proven high process/product capabilities
       · Equipment configuration depends on customer’s requirement and application
       · Up to 9 process modules
       · Standard configuration
       (300mm) EFEM, LL, transfer, (Multi) degas, preclean (Etch), process
       (200mm) VCE, transfer, degas with aligner, preclean (Etch), process
       * Detailed system configuration depends on the applied process
       · Benefit of multi_degas : longer degas, low Rc and no loss in throughput
       · Ensures compliant interface, maximum tool utilization and full fab integration by the windows
       · interface and SEMI SECS/GEM
       · Uniformity : ≤ 3% for film (Depends on THK), ≤ 5% for preclean

• Precision ultrashort pulse laser glass process for advanced packaging technologies
• Utilize Bessel beam, spatially designed long uniform focus to

• Enabling fast etch for through glass via (TGV)
• Capable of glass panels up to 510mm x 515mm,

• Inductively coupled plasma (ICP) technology

         Dry etch, desmear, and surface treatment for low-loss high-frequency substrates

• Magnetron sputter physical vapor deposition (MS PVD) technology

         Deposition of adhesion and copper seed layers for SAP and mSAP processes

• Modular system design technology

         Inline system for simultaneous double-sided processing of HDI+ PCBs and glass substrates

• Touch-free transport and particle-free environment technology

         Magnetic drive technology and vertical panel-in-frame
         orientation for damage-free transport and contaminationfree
         processing

• Plasma enhanced chemical vapor deposition (PECVD) technology

         Deposition of dielectric layers using inductively coupled
         plasma for advanced substrate applications

• ESC cooling technology

         Efficient thermal management for precise temperature
         control during anisotropic plasma etch and deposition
         processes, ensuring material stability