AXCELIS TECHNOLOGIES

Beverly,  MA 
United States
http://www.axcelis.com
  • Booth: D622

Accelerating Intelligent Solutions in Ion Implant

Overview

Axcelis has been providing innovative, high-productivity solutions for the semiconductor industry for over 45 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. 

At Axcelis, we have a single goal: to help semiconductor manufacturers achieve the highest quality and yield, with the lowest cost of ownership. We deliver on that goal with ion implant platforms based on unique enabling technologies that provide unmatched purity, precision and productivity. The result: competitive advantage for our customers—and rapid growth for Axcelis.

At Axcelis, we understand that different semiconductor applications pose their own unique ion implantation challenges. We combine industry-leading technical expertise in fab process optimization with the most advanced ion implant technologies to deliver practical solutions tailored to the specialized needs of distinct market segments, including power devices, image sensors, mature process technology, memory and logic devices.


  Products

  • Purion H Series high current ion implanters
    Purion H ion implanters bring the industry-leading process control of our medium current platforms to the full range of demanding, high-current applications....

  • The flexibility of the platform enables us to tailor Purion H to the specific energy or dosing requirements of your application. The Purion H offers unmatched versatility, throughput and uniformity, so you can achieve greater yield with the lowest cost of ownership.

    Unique scanned-spot-beam architecture with the Purion Contamination Shield™. The Purion High Current Platform features a five-filter beamline design including a field proven energy filter for extreme purity. Each system includes the patented, filament-free microwave Plasma Electron Flood (PEF) to enable wafer neutralization without additional metals contamination.

    Purion Vector™ dose and angle control system ensures highly precise, uniform dopant placement across the entire wafer by precise measurement and control of both horizontal and vertical angles. The scanned spot beam architecture enables a unique damage engineering knob to tailor the implant profile to optimize device performance.

    IdealScan™ is an Axcelis patented technique to scan the spot beam to maximize the use of the spot beam for highest beam current in the region of interest.  The combination of high beam current and the Purion 500 wph end station makes Purion High Current tools the highest in productivity.

  • Purion H200 Series ion implanters
    The Purion H200 is our state-of-the-art single wafer high current medium energy implanter....

  • The Purion H200 is our state-of-the-art single wafer high current medium energy implanter and the only true high current medium energy tool on the market. It has the industry’s widest energy range, from 10keV to 230keV. The Purion H200 combines high current power with medium current precision using advanced beamline technology from Purion H and high energy capabilities from Purion M.

    Designed with Axcelis’ hybrid filtration architecture to filter metals, the proprietary angular energy filter design to filter energy contamination and increased pumping to mitigate photoresist outgassing effects.

    The Purion H200 comes with the Vector Dose and Angle Control System that delivers beams with angular precision and unique constant focal length scanning to enable the same dose rate on the top and bottom of the substrates even at high tilt.

    Unmatched productivity in the medium energy space which is enabled via the combination of a high current beamline with the medium current acceleration column and terminal design.

  • Purion XE Series high energy ion implanters
    Our Purion XE series of ion implanters have rapidly earned a reputation as the industry standard for today’s demanding high energy recipes....

  • Our Purion XE series of ion implanters have rapidly earned a reputation as the industry standard for today’s demanding high energy recipes. Their unique RF Linear Accelerator (LINAC) technology offers higher reliability, a wider energy range and greater productivity than competing platforms, with superior metals contamination control.

    The multi-filtration technology in our RF LINAC-based beamline filters out impurities other designs miss, achieving the industry’s lowest levels of metals and particulates contamination.
    Proprietary VectorTM control system uniquely provides in-situ horizontal and vertical measurement and correction, enabling zero-degree implants.
    Achieve throughput of up to 500 WPH, thanks to our high-speed Purion End Station and our RF LINAC-based beamline, offering the industry’s highest beam currents over the broadest energy range—from 40keV to 15MeV.
  • Purion M Series medium current ion implanters
    Our Purion M ion implanters offer the broadest spectrum of mid-current doses available....

  • Our Purion M ion implanters offer the broadest spectrum of mid-current doses available, offering unparalleled flexibility to meet today’s evolving implant requirements. With high energy capability far beyond competitive implanters, the Purion M is ideal for fabs at higher elevations or those dealing with heavy mass species. Yet it’s 20% more energy efficient than competing platforms, contributing the industry’s lowest cost of ownership.

    Hybrid beamline design employs both magnetic and electrostatic filtration for best-in-class metals performance at all energy levels—ideal for image sensor applications.

    Advanced angle control features in-situ X and Y measurement and control for extreme precision. Unique Constant Focal Length Scanning delivers precisely consistent beam dose, angle, energy, and density across the entire wafer surface.

    Our unique EternaTM ELS source offers the industry’s broadest energy range (2KeV – 1 MeV) for unmatched implant efficiency. Our high-speed Purion End Station enables throughput of up to 500 WPH. Purion M offers the industry-leading productivity for SiC doping applications with highest Al+ beam current and unique hot implant (up to 650°C) capability running in production fabs.

  • GSD Ovation high current and high energy batch ion
    The GSD platform is the industry benchmark for the longest manufactured and supported batch ion implanter....

  • The GSD platform is the industry benchmark for the longest manufactured and supported batch ion implanter. The Ovation™ is the latest batch configuration designed to seamlessly integrate with the existing fleet of Axcelis batch implanters, while providing incremental performance improvements with updated components for long-term sustainability. The Ovation extends the GSD series platform’s production relevance into the future while delivering the highest reliability, serviceability and lowest cost of operations.

    The new Ovation configuration is the industry’s tool of record for capacity expansion and beyond. Innovative improvements like the Virtual Machine RAID Workstation with the High Performance Endstation combined with a proactive continuous improvement roadmap enables the fastest most cost effective way to extend, optimize and sustain platform capability.

    The system features a 95% reduction in mishandles and wafer breakage for in-vacuum wafer handling. The Ovation platform provides continuous reliability programs and robust software support to ensure the highest level of tool uptime.

    The combination of the innovative Hydrogen Generator, Source Bushing Shields and Extended Life Extraction Electrodes deliver up to 40% reduction in source operating costs especially with fluorinated species.