TSE Co., Ltd.

Cheonan-si,  Korea (South)
http://www.tse21.com
  • Booth: A704

30 years of innovation archive, leading the future.

Overview

TSE’s 30 years is a history of innovation and bold challenges. Through continuous advancements, we have become a pioneer in the semiconductor testing industry in Korea. We have evolved into creators of cutting-edge technology that goes beyond current limitations and visionaries shaping a positive future.

TSE’s 30-year heritage of innovation is demonstrated through its diverse customer experiences, proven capabilities, and exceptional track record. We don’t just follow technology, we set new standards and become industry leaders.

We have developed LC components using MEMS technology and have become the world’s only company to provide i3unify, an integrated interface solution for the three key test InterconnecXion hardware components of high-performance semiconductor devices: probe cards, interface boards, and test sockets. TSE’s continuous innovation and commitment to challenges form its unique value, enabling it to move forward into the future alongside its customers.


  Products

  • Probe Card
    TSE ensures reliable inspection of semiconductor chips through precise probing technology....

  • We provide innovative solutions for accurately inspecting the electrical behavior of DRAM, NAND, and SoC chips through advanced probe card design and manufacturing technology. Our probe cards are equipped with high-precision technology capable of probing all pads of a die formed on a wafer. Since thousands of dies can be probed simultaneously, the entire wafer can be inspected at once, minimizing variations in electrical characteristics between dies and ensuring reliable inspection results.
  • Interface Board
    The interface board is a crucial component of a semiconductor test system, determining the performance of ultra-high-speed testing systems....

  • Memory and non-memory test interface boards are essential InterconnecXion hardware in semiconductor test systems, deliver electrical signals between the device under test (DUT) and the test equipment. They offer stable test solutions in various environments, enabling the verification of high-speed memory devices like DDR, LPDDR, and GDDR, as well as non-memory devices such as CPUs, GPUs, chipsets, APs, and microcontrollers

  • Test Socket
    Beyond Performance Not only do we offer the best performance, but we also provide exceptional price and delivery competitiveness....

  • A test socket is a device used to test the performance of a semiconductor chip after the packaging process. It functions as test InterconnecXion hardware, sorting good and defective chips before the packaged product is shipped. The test socket temporarily holds the packaged chip (the test device) and transmits electrical signals between the test device and the test equipment through mechanical contact.

    With advancements in semiconductor packaging technology, ultra-fine pitch, large size, and high pin-count packages are emerging, creating a demand for high-spec test sockets with various shapes for inspection. In response, TSE has developed leading-edge technology for both Spring Pin and Elastomer types, offering a diverse product lineup to supply the optimal test sockets tailored to customer environments.