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HEIDELBERG INSTRUMENTS KOREA

Heidelberg,  Germany
https://heidelberg-instruments.com/
  • Booth: G505

Experience the power of direct writing

Overview

With over 40 years of experience and 1,500+ systems installed worldwide, Heidelberg Instruments is a global leader in high-precision laser lithography systems, maskless aligners, and nanofabrication tools. Our portfolio spans from compact tabletop solutions for prototyping, R&D, and small series production to advanced photomask manufacturing equipment for high-volume industrial use. This broad offering enables support for a wide spectrum of micro- and nanoscale surface structuring techniques, including 2D patterning and 2.5D features via grayscale lithography. Trusted by leading universities, research institutes, and industrial facilities, our systems are used in micro-optics, photonics, electronics, sensors, semiconductors, advanced packaging, next-gen displays, quantum devices, MEMS, microfluidics, 2D materials, photomask production, and more. 

  Press Releases

  • Heidelberg, Germany – Heidelberg Instruments has made significant performance upgrades to its renowned DWL 66+ direct-write lithography system, solidifying its position as the ultimate research tool for microfabrication. The system now delivers a market-leading minimum feature size of 200 nm and advanced grayscale capabilities with 65,536 levels, empowering researchers to push the boundaries of innovation in different dimensions.

    The new High-Resolution Mode, Write Mode XR, achieves an unsurpassed combination of resolution, quality, and speed. Its 200 nm minimum feature capability allows for the fabrication of highly complex micro- and nanostructures, enabling applications in quantum devices, optics, and photonics that previously required more time-consuming e-beam lithography. This advancement accelerates development cycles and frees up cost-intensive e-beam systems for their most demanding tasks.

    Complementing the high resolution is the system's professional-grade grayscale lithography. With an unprecedented 65,536 intensity levels, the DWL 66+ can create intricate 2.5D microstructures, such as micro-lenses and other micro-optical devices, with outstanding surface smoothness in photoresists up to 150 µm thick.

    With 30 years of continuous development and over 400 units installed, the DWL 66+ is a proven, robust, and extremely flexible platform for R&D and rapid prototyping. These latest enhancements reinforce its value, offering users a powerful combination of extreme resolution and operational flexibility.

    For more information on the DWL 66+ lithography system, please visit: https://heidelberg-instruments.com/product/dwl-66-laser-lithography-system/

  • Heidelberg, Germany —Heidelberg Instruments proudly celebrates the 10th anniversary of the MLA 150 Maskless Aligner—a breakthrough that has redefined high-resolution lithography in cleanrooms around the world. Since its launch in 2015, the MLA 150 has provided researchers and engineers with a flexible, mask-free alternative to traditional photolithography, transforming microfabrication across both academia and industry.

    “The MLA 150 Maskless Aligner was created to address bottlenecks in multi-user cleanrooms caused by aging mask aligners and time-consuming photomask production. Heidelberg Instruments envisioned a direct-write solution with better performance than a mask aligner—without the delays. The result: fast turnaround, high accuracy, and exceptional ease of use”, states Steffen Diez, COO Heidelberg Instruments.

    At the heart of the MLA 150 is a digital micromirror device (DMD), acting as a dynamic mask, paired with solid-state light sources and advanced alignment capabilities. This combination made the system a game-changer from day one. With exposure times under 10 minutes, full process cycles under 30 minutes, and user training completed in under an hour, the MLA 150 quickly set a new benchmark for R&D lithography. “The MLA 150 is one of the most consistently utilized tools in our cleanroom,” says Dr. Tom Peach, Senior Process Engineer at Cardiff University. “Its flexibility and ease of use have made it a cornerstone of our lithography workflows.”  By enabling users to go from digital design to a perfectly patterned substrate in minutes, the MLA 150 empowers rapid innovation in fields such as quantum devices, MEMS, micro-optics, and life sciences.

    Refined through close collaboration with leading institutions—including EPFL, the Kirchhoff Institute for Physics (KIP) at Heidelberg University, and the Harvard Center for Nanoscale Systems (CNS)—the MLA 150 quickly proved its value. At KIP, for example, it enabled a threefold increase in yield for complex SQUID (superconducting quantum interference device) sensor fabrication, demonstrating its transformative impact. While initially embraced by research labs, the system’s versatility and cost-efficiency soon attracted industrial users seeking agile solutions for rapid prototyping and small-series production. From foundational research in quantum materials to the development of life-saving biosensors, the MLA 150 has been a silent partner in countless discoveries.

    In 2025, Heidelberg Instruments introduced a major upgrade to the MLA 150, pushing the minimum feature size to 450 nm and expanding its capabilities for high-precision applications.

    Today, the MLA 150 is a trusted workhorse in more than 250 cleanrooms worldwide. As Heidelberg Instruments celebrates this milestone, it also honors the global community of users, engineers, and partners who have helped shape the MLA 150 into a transformative platform—one that continues to push the boundaries of what is possible in microfabrication.

    Further information: https://heidelberg-instruments.com/mla-150-anniversary/

  • Heidelberg, Germany — Heidelberg Instruments has received a substantial order from a top-tier photomask manufacturer in Asia for a VPG+ 1850 FPD system, developed on the established platform of its flagship VPG+ 1400 FPD Volume Pattern Generator. Delivery is scheduled for Q1/2027.

    “The new VPG+ 1850 FPD will be the largest system in Heidelberg Instruments’ portfolio, engineered specifically for large-format photomask applications beyond G8, supporting mask sizes up to 1400 x 1850 mm²”, says Matthias Wahl, strategic product manager of the VPG series. The VPG FPD series is optimized for display photomask generations typically ranging from G5 to G8.6. With exceptional throughput and precision, the system sets a new industry standard for scalable, high-accuracy photomask production in this field.

    This system upgrade reflects Heidelberg Instruments’ ongoing dedication to innovation in high-performance display manufacturing, serving the rising demand for advanced patterning solutions in the flat panel display (FPD) industry. “The recent order represents another key achievement for Heidelberg Instruments, highlighting our strong market position in display technology, and reaffirming our commitment to driving innovation and excellence in photomask production systems”, states Alexander Forozan, VP of global sales and business development.

    As a trusted partner for photomask manufacturers, particularly in the display industry, Heidelberg Instruments provides reliable systems that are pivotal for enabling next-generation flat panel display production with excellent precision and high throughput. The high-end solutions are specifically engineered to meet the rigorous demands of large-scale manufacturing environments, ensuring consistent quality, economical operation, and outstanding performance across a wide range of advanced applications.

    Further information: https://heidelberg-instruments.com/product/vpg-1400-1850-fpd/

  • Advancing Thermal Scanning Probe Lithography

    Zurich, Switzerland — Following the successful introduction of the modular NanoFrazor nanolithography system in 2024, Heidelberg Instruments is proud to announce the installation of the newest NanoFrazor. The system is equipped with the recent modules, enabling parallelized thermal scanning probe lithography (t-SPL). The beta site is hosted by the research partner EPFL, the Swiss Federal Institute of Technology in Lausanne, Switzerland. The installation marks a significant step forward in joint efforts to bring next-generation nanofabrication technologies into practice, promising advances in nanoscale research and applications.

    Designed for high-resolution lithography down to 20 nm, with application flexibility and increased throughput, the system features parallelized t-SPL with ten heated tips writing simultaneously, Direct Laser Sublimation (DLS), and advanced automation. “Parallelizing t-SPL was the logical next step in advancing thermal nanolithography. The implementation, however, was far from trivial.” states Dr. Emine Cagin, CTO of Heidelberg Instruments Nano AG. “Parallelization required a decade of development, culminating in a new and scalable framework for electronics and software that now powers the new NanoFrazor.”

    The new module, named the Decapede, increases the throughput up to tenfold, without compromising on high-resolution capabilities.  “With improved throughput, we are considering upscaling grayscale nano surfaces that enable deterministic and localized strain engineering of 2D materials from chip-level to wafer-scale for potential industrial integration”, says Berke Erbas, Postdoctoral Researcher in the Microsystems Laboratory at EPFL. “We also aim to upscale grayscale nanoimprint lithography stamps fabricated through t-SPL and dry-etching approaches.”

    EPFL — A Hub for Innovation
    EPFL’s expertise in t-SPL and broad nanofabrication capabilities make it an ideal beta site and mark the continuation of a long-standing, trusted partnership with Heidelberg Instruments. The consortium of research groups involved brings together a combination of deep knowledge in t-SPL and diverse nanofabrication techniques, along with fresh ideas and challenging applications. The generous commitment to providing continuous feedback will help Heidelberg Instruments further validate the system performance and refine user interfaces.

    From Nanoelectronics to Quantum Devices, a Look Ahead

    The EPFL beta site is not only a testing and validation site for the system’s capabilities but first and foremost a catalyst for innovation in nanolithography. Applications at the EPFL beta site span nanoelectronics, plasmonics, quantum devices, and bio-nano-sensors. Jürgen Brugger, Professor in Microengineering and Materials Science at EPFL, highlights: “t-SPL has proven to be an excellent tool for educating junior researchers due to its capabilities for fast prototyping with a low threshold to create nano-patterns in short time scales. We are excited to expand towards parallel writing capabilities.” For example, the Laboratory of Nanoscience for Energy Technologies (LNET), Professor Giulia Tagliabue, is exploring the use of its gray-scale functionalities for realizing advanced metasurfaces that can strongly confine light at nanoscale dimensions for energy conversion and probing of interfacial processes.

    We are looking forward to seeing how the beta site will accelerate discoveries and enable new possibilities in nanoscale science, both in research and educational use of the NanoFrazor system.

    Further information: https://heidelberg-instruments.com/product/nanofrazor/

  Products

  • VPG+ 1400 FPD/VPG + 1850 VOLUME PATTERN GENERATORS
    Designed for photomask production on large substrates in display applications, and tailored for the high-throughput patterning of large-area photomasks up to G8.6 size and a maximum exposure area of 1400 x 1800 mm²....

    • VPG+ 1400 FPD / VPG+ 1850 Volume Pattern Generator | Heidelberg Instruments

    Engineered for photomask production on substrates up to G8.6 (1400 × 1800 mm²), the VPG+ 1400/1850 FPD delivers exceptional throughput, 1.2 nm alignment precision, and Mura optimization. Ideal for TFT arrays, color filters, and ITO electrodes in high-volume FPD manufacturing. Reliable 24/7 operation ensures consistent quality and delivery.

    Key Benefits

    • Optimized for FPD Manufacturing: Tailored for TFT arrays, color filters, and ITO electrodes.
    • Exceptional Throughput: Accelerates photomask production for high-volume display lines.
    • Reliable 24/7 Operation: Ensures consistent performance and predictable delivery.
    • 1.2 nm Alignment Precision: Uses differential interferometry for ultra-accurate patterning.
    • Mura Optimization: Achieves excellent CD uniformity and resolution across large areas.
    • Closed-Loop Environmental Chamber: Maintains thermal and particle stability for high-quality results.
    • Advanced Metrology: Enables precise second-layer alignment and greytone mask production.
  • VPG 300 DI | MASKLESS STEPPER
    Stepper-level performance with unmatched speed and flexibility for R&D, prototyping, and microfabrication: The VPG 300 DI is a high-performance direct-write lithography system for patterning high-resolution microstructures on wafers up to 300 mm....

    • VPG 300 DI Maskless Stepper | Heidelberg Instruments

    VPG 300 DI – The Power of a Stepper, The Freedom of Direct Write

    The VPG 300 DI bridges the gap between R&D and production, offering sub-micron resolution and tight overlay accuracy comparable to traditional i-line steppers—without the cost and delays of mask procurement. Ideal for rapid prototyping, process development, and applications requiring frequent design iterations. From CAD to exposure in minutes, the system enables fast design transfer and daily iteration cycles, dramatically accelerating development timelines.

    Key Benefits

    • High-Speed Exposure: Custom SLM and optimized data path enable 100×100 mm² writing in just 9 minutes
    • Stitching-Free Large Areas: Create large dies or devices without stitching errors
    • Instant Design Changes: Modify CAD files and expose immediately—no mask handling required
  • MLA 300 | MASKLESS ALIGNER FOR VOLUME PRODUCTION
    The MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. It supports wafers up to 300×300 mm and adapts to surface variations, eliminating costly, time-consuming mask production....

    • MLA 300 Industrial Maskless Aligner ǀ Heidelberg Instruments

    The MLA 300 Maskless Aligner enables innovative solutions for complex lithography challenges, including advanced packaging, sensor calibration, and MEMS fabrication. With high throughput, 1.5 μm resolution, a simplified workflow, and seamless MES integration, it is the ideal choice for a wide range of industrial applications. 

    Application areas include semiconductors and advanced packaging, sensor and sensor ICs, MEMS and microfluidics, discrete components, integrated circuits and ASICs, probe cards, power electronics, and OLED displays.

    Key Features

    • High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
    • Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
    • Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
    • Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.
  • ULTRA | SEMICONDUCTOR LASER MASK WRITER
    The ULTRA delivers high-throughput, high-precision photomask writing for mature semiconductor nodes. A cost-effective solution for producing photomasks for microcontrollers, PMICs, LEDs, IoT, photonics, and MEMS—maximizing yield, speed, and reliability....

    • ULTRA Semiconductor Mask Writer | Heidelberg Instruments

    The ULTRA integrates state-of-the-art technology to address the primary concerns of modern mask shops: speed, accuracy, and return on investment.

    The system’s advanced exposure engine and optimized write modes dramatically reduce mask writing times, enabling you to produce a standard 6” photomask in less than 45 minutes.

    • Fast SLM-based Exposure Engine: Delivers write speeds up to 580 mm²/minute without compromising quality.
    • Full Automatic Mask Handling: Reduces operator overhead with a simple, easy-to-use mask loading interface and ensures consistent, repeatable loading and unloading for continuous operation.
    • Optimized Write Modes: Provides the flexibility to prioritize speed or resolution to match your specific job requirements.
  • MLA 150 | ADVANCED MASKLESS ALIGNER
    The MLA 150 Maskless Aligner accelerates innovation with sub-micron lithography down to 0.45 μm, eliminating photomasks and long lead times. From design to substrate in minutes—fast, flexible, and easy to use. Ideal for R&D, and industrial prototyping....

    • MLA 150 Advanced Maskless Aligner ǀ Heidelberg Instruments

    Key Benefits

    • No Photomasks Required: Pattern directly from digital designs using a dynamic mirror device (DMD).
    • Fast Turnaround: Expose a full 150 mm wafer in under 16 minutes.
    • Sub-Micron Precision: Achieve feature sizes down to 0.45 μm.
    • User-Friendly Interface: Train new users in under an hour—ideal for shared lab environments.

    Designed for R&D and Small Series Production, the MLA 150 is built for flexibility, making it the perfect tool for:

    • Academic Research Labs
    • Industrial Prototyping
    • Small Batch Manufacturing

    Applications include quantum devices, MEMS, micro-optics, and life sciences.

    Advanced Capabilities

    • Dual-Wavelength Exposure: Supports 375 nm and 405 nm lasers for compatibility with g-, h-, and i-line photoresists.
    • Versatile Substrate Handling: Easily process small pieces (down to 3×3 mm²), thin foils, and warped wafers.
    • Grayscale & High-Aspect-Ratio Modes: Create complex 2.5D structures and steep sidewalls for MEMS and microfluidics.
    • Interactive “Draw Mode”: Directly draw and expose patterns on live camera images—ideal for quick prototyping and precise electrode placement.

    Precision & Stability

    • Automated Alignment: Achieve 250 nm accuracy with digital compensation for offset, rotation, and scaling.
    • Dynamic Autofocus: Ensures sharp, uniform features across varied substrates.
    • Environmental Control: Integrated chamber with temperature-controlled laminar airflow (±0.1°C) for consistent, repeatable results.
  • DWL 66+ | THE ULTIMATE LITHOGRAPHY RESEARCH TOOL
    The DWL 66+ offers unmatched versatility, 200 nm resolution, and professional-grade grayscale with 65,536 levels. Ideal for R&D and prototyping. Fully customizable and proven in over 400 installations....

    • DWL 66⁺ Ultimate Lithography System ǀ Heidelberg Instruments

    The DWL 66+ is a high-performance direct-write laser lithography system engineered for R&D and rapid prototyping across a wide range of microstructure applications, including MEMS, microfluidics, optics, photonics, and quantum devices.

    It delivers the highest resolution on the market (down to 200 nm), professional-grade grayscale capabilities with 65,536 levels, and unmatched versatility through a fully customizable system configuration. With over 400 systems installed worldwide, it’s a proven solution for advanced research environments.

    Key Features

    • Write Mode XR: Achieve 200 nm minimum feature size with exceptional speed and quality.
    • Grayscale Lithography: Outstanding surface quality in thick resists up to 150 µm.
    • Flexible Substrate Handling: Compatible with diverse materials, shapes, and sizes—including curved surfaces.
    • Real-Time Autofocus: Dual autofocus system ensures precision even on transparent or low-reflectivity substrates.
    • Interferometric Position Control: Guarantees high pattern fidelity and placement accuracy.

Categories

200 Equipment, Assembly
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
    • 204 Equipment, Mems
  • Double sided mask aligner
    • 205 Equipment, Nanotechnology
  • Equipment, Nanotechnology Tools
    • 207 Equipment, Process
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
    • 700 Manufacturing Services
  • Lithography; Patterning service
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