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RIGAKU CORPORATION

  • Booth: C750

RIGAKU - Leading with Innovation

Overview

Since its inception in Japan in 1951, Rigaku has been at the forefront of analytical and industrial instrumentation technology. In fact, Rigaku means physical science in Japanese, the core of instrumentation. With hundreds of major innovations to its credit, Rigaku and its subsidiary companies are world leaders in the fields of protein and small molecule X-ray crystallography, general X-ray diffraction, X-ray spectrometry, semiconductor metrology, automation, cryogenics and X-ray optics. Rigaku employs over 1,000 people worldwide in the manufacture and support of its analytical equipment. Whether supplying the tools to create better semiconductor chips, enabling drug discovery, improving production line quality, or exploring the new frontier of nanotechnology, Rigaku products and services lead with innovation. Rigaku was chartered to be the world's leading X-ray analytical instrumentation company.


  Press Releases

  • PRESS RELEASE

    December 4, 2025

    High-precision wafer measurement meets surging demand from AI and data centers

    XTRAIA MF-3400Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers. The XTRAIA MF-3400 will significantly enhance productivity in the rapidly growing semiconductor market by enabling high-accuracy evaluation of materials essential for mass production of next-generation memory chips and high-speed AI devices.

    As generative AI and data centers continue to expand, demand is rising for high-performance, energy-efficient semiconductors capable of processing vast volumes of data. Consequently, semiconductor structures are becoming more complex, delicate, and three-dimensional, with a single chip integrating billions of microscopic electronic components.

    Stable mass production of these advanced devices requires nondestructive technologies capable of measuring and insulating metal films with nanoscale precision.  

    To meet this need, Rigaku further advanced the X-ray technologies it has cultivated over decades to develop the XTRAIA MF-3400. Among its new capabilities, the XTRAIA MF-3400 supports measurement of molybdenum, an element attracting attention as a next-generation material. 

    EN_omparison of output, in wafers per hour (WPH)

    Comparison of output, in wafers per hour (WPH), of MF-3400 with previous generation tool.

    Key features of the XTRAIA MF-3400

    • Measurement capability up to double that of previous devices
      By doubling the X-ray dose and integrating a new transport system, the number of wafers measurable per hour is dramatically increased.
    • Nondestructive measurement with nanoscale accuracy
      On a field as narrow as 50 µm, less than the width of a human hair, the XTRAIA MF-3400 can measure film thickness with sub-nanometer precision finer than the thickness of a single atom.
    • Multiple analyses on a single device
      The XTRAIA MF-3400 incorporates three analytical functions using X-rays: fluorescent X-rays, X-ray reflectance, and X-ray diffraction. Measurement can be automated by registering optimal conditions in recipes, tailored to objectives including ultra-thin-film structure, thickness, or crystallinity.

    Track record and prospects

    KIOXIA Corporation and KIOXIA Iwate Corporation have decided to implement the XTRAIA MF-3400 into mass-production lines for 3D NAND flash memory1. The device is also expected to be used in next-generation memory production, where high capacity and high data transfer rates are essential and mass production adoption is imminent.

    Moreover, manufacturers of DRAM2 and logic semiconductors3 are also expected to adopt the XTRAIA MF-3400. Combines with its predecessor model, Rigaku anticipates net sales to exceed JPY 6 billion in FY2026.

    A range of modules can be selected for the XTRAIA MF-3400 tailored to different applications. This flexibility enables each manufacturer to construct the measurement environment that is ideal for its manufacturing processes. Leveraging these strengths in versatility and scalability, Rigaku will continue to develop applications in new material and process fields, aiming for sustainable growth of 20% per year in FY2027 and beyond for both model series.

    Memory media that use a 3D structure to achieve high capacity, high speed and low power consumption
    Volatile main-memory devices that hold data temporarily; high-speed operation is a key feature
    Semiconductors used for processes such as calculation and control

    Product details

    https://rigaku.com/products/semiconductor-metrology/xrr-edxrf-and-optical-tools/xtraia-mf-3400 

    About the Rigaku Group

    Since its establishment in 1951, the engineering professionals of the Rigaku group have been dedicated to benefiting society with leading-edge technologies, notably including its core fields of X-ray and thermal analysis. With a market presence in 136 countries and regions and some 2,000 employees from 9 global operations, Rigaku is a solution partner in industry and research analysis institutes. Our overseas sales ratio has reached approximately 70% while sustaining an exceptionally high market share in Japan. Together with our customers, we continue to develop and grow. As applications expand from semiconductors, electronic materials, batteries, environment, resources, energy, life science to other high-tech fields, Rigaku realizes innovations “To Improve Our World by Powering New Perspectives.”

    For details, please visit: rigaku-holdings.com/english

    Press contact:

    Sawa Himeno
    Director, Communications Dept., Rigaku Holdings Corporation
    [email protected]
     


  Products

  • XTRAIA MF Series
    XRR, EDXRF, and XRD Metrology Tool...

  • For composition and thickness (EDXRF), thickness, density, and roughness (XRR) for unpatterned and patterned films for up to 300 mm wafers

    For thin-film applications, precise measurements of small areas are obtained, and high brightness is achieved in localized spots.

    The Rigaku XTRAIA MF-3000 (formerly MFM310) performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.

    Details

  • XHEMIS TX Series
    Total Reflection X-ray Fluorescence System...

  • Ultrahigh-speed metal contamination mapping

    Total Reflection X-ray Fluorescence (TXRF) is widely used for measuring metal contamination in semiconductor manufacturing processes such as cleaning, lithography, etching, and thin film deposition.

    XHEMIS TX-3000 is a state-of-the-art TXRF system equipped with a multi-element detector that enables simultaneous measurement at three locations, in addition to the conventional 1-target, 3-beam configuration. This allows for high-throughput analysis with high sensitivity and efficiency, covering elements from Na to U.

    XHEMIS TX-2000, the successor to the TXRF 3760, was unveiled for the first time at SEMICON Japan. It comes standard with a Fan Filter Unit (FFU) and supports transparent substrates such as glass and sapphire. Combined with AI-powered software, it achieves double the throughput compared to previous models.
    Details

  • ONYX Series
    Hybrid energy dispersive X-ray fluorescence and optical techniques...

  • Micro-spot EDXRF and Optical Inspection (2D-3D)

    The ONYX series systems are designed to provide a holistic metrology approach in all steps of the manufacturing process from FEOL through WLP, including optimal configuration for advanced packaging and single bump applications to monitor Ag/Sn ratio proven results in measuring and identifying single solder μ-bumps less than 5 μm diameter.

    Detail

  • XTRAIA XD Series
    In-line HRXRD and XRR Metrology Tool...

  • Measurements results include film thickness, density, and roughness (by X-ray reflectometry, XRR) and epitaxial film thickness, composition, strain, lattice relaxation, and crystal structure quality (by high-resolution XRD, HRXRD).

    XTRAIA XD-3300’s original X-ray optical system is the key performance enabler. Combining ultra-high-performance mirrors with bent crystals, this system enables measurements to be completed at up to 100 times the speed of previous products. The diffraction measurement tasks that once took several hours can now be completed in just a few minutes.

    Details

  • XRTmicron Series
    X-ray Topography Systems...

  • High-resolution, non-destructive wafer defect imaging for every stage of semiconductor manufacturing

    • Three configurations: Lab, Near-Fab, and Fab systems for seamless R&D to production scaling
    • Up to 300 mm wafers with full-wafer, non-destructive defect detection
    • Multi-material support: Si, SiC, GaN, InP, GaAs, AlN, Ga₂O₃, Sapphire, and more
    • SEMI-compliant QC tools for TSD, BPD and MP quantification in SiC

    Details