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C.C.P. CONTACT PROBES CO., LTD.

New Taiei City,  Taiwan
http://www.pccp.com.tw/
  • Booth: W621

Welcome to C.C.P., where precision powers innovation.

Overview

C.C.P. Contact Probes Co., Ltd. is one of the global leader in advanced contact solutions, delivering precision, reliability, and innovation to the electronics industry since 1986. With expertise in contact probes, pogo pins, spring-loaded connectors, and custom interconnect technologies, we support applications ranging from semiconductor test and consumer electronics to automotive, AI, and high-current power systems. Our engineering-driven approach ensures every product meets strict performance standards through rigorous material selection, mechanical design, and automated quality control. As a trusted partner to world-class manufacturers, C.C.P. is committed to accelerating next-generation technologies by providing stable, efficient, and tailored interconnect solutions. With strong global service, collaborative development, and a focus on long-term reliability, we help customers bring smarter, faster, and more connected innovations to life.


  Press Releases

  • A global AI-glasses manufacturer approached C.C.P. with a critical technical challenge in their charging case connector. The application required high electrolysis resistance and superior anti-corrosion performance, yet existing market alternatives failed electrolysis testing in under one minute. The customer set a clear target: electrolysis resistance exceeding 60 minutes, supported by enhanced long-term corrosion robustness.

    C.C.P.’s engineering and materials teams conducted a comprehensive evaluation of structural design, coating characteristics, and failure mechanisms. Through this process, we identified a breakthrough direction and implemented APT advanced plating technology, which effectively strengthened anti-electrolytic corrosion capability while reducing plating stress for improved stability.

    Following rigorous verification and qualification procedures, the enhanced connector achieved:

    • Salt-spray performance exceeding 168 hours

    • Electrolysis resistance over 60 minutes

    By delivering a solution that met and surpassed the customer’s specifications, C.C.P. successfully resolved a key reliability bottleneck in the charging system. This achievement not only earned the customer’s confidence but also resulted in the confirmation of production orders.

    This case demonstrates C.C.P.’s commitment to engineering precision, material innovation, and high-reliability interconnect solutions for next-generation intelligent devices.


  Products

  • Super Ultra Spring Probe
    C.C.P. Contact Probes Co., Ltd. Launches Super Ultra Spring Probe, Advancing High-Frequency Testing Technology...

  • C.C.P. Contact Probes Co., Ltd. (C.C.P.), a global leader in precision testing solutions, has officially launched the Super Ultra Spring Probe, a breakthrough innovation designed to enhance high-frequency signal transmission and optimize compact testing environments. This cutting-edge probe is set to revolutionize semiconductor, 5G communications, and high-precision testing applications.

    C.C.P. remains committed to driving innovation in the precision testing industry. The launch of the Super Ultra Spring Probe not only provides a stable and reliable high-frequency transmission solution but also meets the increasingly stringent testing demands of the semiconductor and advanced communication sectors. Looking ahead, C.C.P. will continue to expand its expertise in precision testing, supporting the global technology industry in achieving higher standards.

    For more information, please visit https://www.ccpcontactprobes.com to contact our team.

  • Coaxial Socket
    Next-Generation Chip-Scale Contact Probe Solution...

  • C.C.P. Contact Probes Co., Ltd. (C.C.P.) introduces its next-generation Chip-scale Contact Probe solution to meet the advanced semiconductor test demands. This coaxial socket solution is specifically designed for leading semiconductor companies, offering more efficient and precise testing capabilities to meet the stringent validation requirements of AI, high-performance computing (HPC), and 5G chips.

    Innovative Probe Technology Enhances Testing Performance

    C.C.P.’s latest solution features an innovative structural design of coaxial socket, achieving higher contact reliability and low impedance characteristics. This significantly reduces test errors and signal loss. Additionally, the technology ensures stable testing for high-frequency and high-power chips, effectively extending probe lifespan and reducing testing costs.

    C.C.P. will continue to innovate and collaborate with industry partners to provide the semiconductor industry with more competitive testing solutions, driving the development and application of next-generation chips.

    For more information, please visit https://www.ccpcontactprobes.com to contact us.