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YIELD ENGINEERING SYSTEMS KOREA, INC.

Hwaseong-si,  Korea (South)
http://www.yieldengineering.com
  • Booth: W408

Advanced Packaging Process Solutions for WLP and PLP

Overview

Yield Engineering Systems, Inc. (YES) is a leading provider of advanced process equipment for surface and materials engineering, with a strong focus on wafer-level packaging (WLP) and panel-level packaging (PLP) applications. The company offers a comprehensive portfolio of thermal processing, chemical vapor deposition (CVD), and wet process systems designed for precise surface modification and process control.

YES solutions are widely used in advanced packaging processes such as cure, anneal, degassing, and fluxless reflow, supporting high-volume manufacturing requirements for semiconductor substrates, semiconductor and MEMS devices, LED displays, and biomedical devices. Customers ranging from innovative startups to Fortune 100 companies rely on YES equipment to enable reliable, scalable, and cost-effective production.

Headquartered in Fremont, California, YES maintains a growing global presence to support customers worldwide.

For more information, visit www.yieldengineering.com


  Products

  • VertaCure LX
    3.5hours vs. 8+hours for atmospheric Laminar flow reduces/elimiates particles More complete cure(5x less outgassing) Less film stress and low wafer warpage 1.6x to 2x less power and N2 Consumption Much lower capital cost, 2-3x lower CoO...

  • VertaCure LX is an advanced thermal curing system designed to significantly improve process efficiency, material performance, and cost of ownership compared to conventional atmospheric curing systems.

    By utilizing a controlled laminar flow environment and optimized thermal profiles, VertaCure LX enables a substantially shorter process time. Typical curing cycles can be completed in approximately 3.5 hours, compared to 8 hours or more required by conventional atmospheric ovens. This reduction in process time directly increases throughput and overall manufacturing productivity.

    The laminar flow architecture minimizes turbulence inside the chamber, effectively reducing particle generation and transport during the curing process. As a result, VertaCure LX provides a cleaner process environment, helping to improve yield and device reliability, especially for advanced packaging applications.

    VertaCure LX delivers a more complete cure, demonstrated by up to 5× lower outgassing compared to atmospheric curing. Reduced outgassing leads to improved film integrity, enhanced material stability, and better downstream process compatibility. This is particularly critical for sensitive materials used in wafer-level and panel-level packaging.

    The system also enables lower film stress and reduced wafer warpage through uniform temperature distribution and controlled gas flow. These characteristics are essential for maintaining tight warpage specifications and improving handling stability in subsequent processing steps.

    From an operational standpoint, VertaCure LX significantly lowers utility consumption. Optimized thermal efficiency allows the system to consume 1.6× to 2× less electrical power and nitrogen (N₂) compared to conventional atmospheric curing tools, contributing to reduced operating expenses and improved sustainability.

    In addition to operational savings, VertaCure LX offers a much lower capital cost, resulting in a 2–3× lower cost of ownership (CoO) over the lifetime of the system. This combination of higher throughput, improved process performance, and reduced capital and operating costs makes VertaCure LX an ideal solution for high-volume manufacturing in advanced packaging environments.