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SCREEN SEMICONDUCTOR SOLUTIONS CO., LTD.

Hwaseong-si, Gyeonggi-do,  Japan
https://www.screen.co.jp/spe/en
  • Booth: D432

Overview

Advancing Tech & Innovation

SCREEN’s exhibits feature a diverse lineup of proprietary semiconductor manufacturing equipment, including the DW-3100, a cutting-edge direct imaging system for advanced semiconductor packages released in December 2025, as well as its number one global share* wafer cleaning system, annealing measurement, and inspection systems. Content related to strengthening production, sustainability initiatives, and technology will also be displayed.
*According to Company Research

  Press Releases

  Products

  • Single Wafer Cleaner “SU-3400”
    The Evolution of the World's No. 1* Cleaning Equipment...

    • The industry' s number one cleaning series takes the next step with a new flagship model
    FEATURES
    High throughput of up to 1,200 wph using 24 chambers
    Footprint reduced by 30%
    Reduction of environmental load: Exhaust/Nitrogen/Chemical
    Reliable operation backed by big data and problem prevention through camera surveillance
  • Spin Scrubber “SS-3200”
    Advanced Transport System Achieves High Throughput of up to 800 wafers per hour...

    • SSRM - double side cleaning in one chamber Applicable to 300mm scrubber
    FEATURES
    Capable of cleaning the frontside and the backside of the wafer continuously in one chamber
    High throughput and zero contamination of the device periphery are achieved due to no cross processing and wafer reversal
    Improved the removal performance of the backside edge
  • Wet Station “FC-3100”
    Next-generation Versatility, Speed and Functionality...

    • The de facto standard batch-type cleaner that boasts high productivity, stability and reliability

    FEATURES

    • 7 independent modules enhance system configuration flexibility
    • High throughput of up to 1,000 wph
    • The HiLPD (low-pressure drying) greatly reduces watermarks and high-concentration IPA vapor prevents pattern collapse
  • Coat/Develop Track ” DT-3000”
    High Productivity, >450 WPH Capable Dual Track System...

    • Coat/develop track equipped with a dual track system for a high throughput of over 450 wph

    FEATURES

    • High productivity and a compact footprint
    • Dual-track system enables non-stop operation
    • Supports immersion multi-patterning
  • Flash Lamp Annealer “LA-3100”
    Contributes Significantly to Improving the Characteristics of State-of-the-Art Devices...

    • The flash lamp annealer significantly contributing to the characteristic advancement of cutting-edge devices
    FEATURES
    Fast annealing over a wide temperature range
    Flash annealing and assist heating enable millisecond annealing
    Flexible temperature profile control in sub-millisecond units
  • Direct Imaging System for Advanced PackagesDW-3100
    High-definition, high-productivity direct imaging system Featuring maskless technology for diverse packaging needs...

    • High-definition, high-productivity direct imaging system Featuring maskless technology for diverse packaging needs

    FEATURES

    • Industry-leading precision of below 1 µm using our proprietary GLV™ imaging heads and optical system
    • Three types of alignment method: global, local and die-by-die
    • Configurations for wafers or square panels selectable based on the manufacturing process
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