scia Systems showcases new innovations in semiconductor failure analysis and photonic integrated circuit processing at Semicon Korea 2026
scia Systems GmbH, the industry leader in advanced ion beam and plasma process equipment for the microelectronics, MEMS, and precision optics industries, will showcase new capabilities at Semicon Korea 2026, taking place February 11-13 at the COEX in Seoul, South Korea.
The company will present its industry-leading scia Mill series of ion beam etching (IBE) systems supporting high-precision, high-throughput semiconductor device manufacturing and failure analysis (FA). scia Systems will also highlight key advances in ion-beam processing for photonic integrated circuit (PIC) manufacturing. The company’s advanced ion beam etching and trimming processes enable the manufacturing of three-dimensional optoelectronic microstructures for PICs, such as waveguides and other optical components.
Advanced Whole-Wafer Failure Analysis for AI and Heterogeneous Integration
Supporting wafer substrates up to 300mm in diameter, the scia Mill series is optimized for whole-wafer delayering in FA workflows. The platform complements existing FA approaches, including mechanical preparation, wet-chemical etching, dry plasma etching, and focused ion beam (FIB) processing. IBE provides greater precision than mechanical prep, faster results than FIB, and compatibility across all materials. It can process semiconductors, metals, ceramics, and multilayer devices, all without causing structural damage to the materials.
In advanced packaging, multilayer devices with numerous ultra-thin layers must be delayered accurately. The scia Mill series combines IBE with secondary ion mass spectrometry (SIMS) endpoint detection to deliver precise control down to sub-nanometer layers. This is especially important for heterogeneous integration devices and components such as chiplets and photonic ICs (PICs), as well as large-area devices such as AI processors.
The scia Mill series opens up two new applications: large-area FA, which enables more efficient analysis of full wafers and large dies, and advanced packaging FA, where delayering complexity and precision requirements are rapidly increasing.
Visit scia Systems at SEMICON Korea 2026
Attendees at SEMICON Korea interested in learning more about scia Systems’ thin-film processing solutions for semiconductors, microelectronics, and optoelectronics are encouraged to visit the company at booth #A354, alongside their Korean sales partner Woowon Technology.
For even deeper insights into the ion beam etching technology, we invite you to attend Denis Joschko's presentation “3D Nanopatterning Using Ion Beam Etching”. At Session 4 on February 12 in Room 307, he will speak about the requirements for 3D nanodevice production and how ion beam patterning can address them.
More Information and the abstract can be found here: https://www.semiconkorea.org/en/node/12576
About scia Systems GmbH
Founded in 2013, scia Systems is a technology leader in thin-film process equipment based on advanced ion beam and plasma technologies. The systems are used for coating, etching, and cleaning processes with nanometer-resolution and have been successfully implemented in various high-tech industries worldwide, including microelectronics, MEMS, and precision optics. For more information, visit the company’s website at www.scia-systems.com.
Contact:
scia Systems GmbH
Mandy Gebhardt
Head of Marketing
Tel.: +49 371 33561 322
E-Mail: [email protected]