Samco Inc.

Fushimi-ku Kyoto-shi,  Kyoto 
Japan
https://www.samcointl.com
  • Booth: 421


Come see us. Our booth focus on the failure analysis market.

From Kyoto to the World

From Kyoto to the forefront of semiconductor processing,

Samco’s systems lead the way in Advanced Thin Film Technology

Production and R&D teams – working in automobile safety, biotechnology, renewable energy and other high-tech ­fields – can’t afford to be without reliable process equipment and support.

Samco’s durable systems, world-class recipe database and prompt service help you minimize downtime and boost cleanroom productivity, while cutting costs at the same time. We give teams reliable tools and resources, enabling your business or organization to push the limits of modern thin-­film technology.

Unlike many of our competitors, Samco specializes in plasma technology with nearly 40 years of experience. Our dedicated engineers and technicians work closely with your production and R&D teams, from assessing your speci­fic challenges, to developing customized solutions, to installing the system in your facility. We also train your production staff and follow up with prompt service and support for the system’s lifetime.

Since the company was ­first founded in Kyoto, Japan by plasma technology pioneer Osamu Tsuji in 1979, more than 4,000 Samco systems have been installed and used for repeatable results in cleanrooms across 30 countries. Our equipment and services are used in a range of industries, including MEMS, Laser Diodes, HB LEDs, TSV, SAW Devices, RF Devices and more.

As a company that specializes in plasma technology, Samco’s engineers, technicians and other team members are dedicated to serving R&D and production teams who need reliable systems, repeatable results and prompt service.

Together, we provide highly e‑ective tools that boosts facility performance and operation, which saves your business or organization time and money.

Your success is our first priority.


 Products

  • Reactive Ion Etching System RIE-10NR
    Samco's RIE-10NR is a low-cost, high-performance, fully automatic, dry etching system that meets the most demanding process requirements using fluorine chemistry....

  • Samco's RIE-10NR is a low-cost, high-performance, fully automatic, dry etching system that meets the most demanding process requirements using fluorine chemistry. A computerized touch panel provides user-friendly interface for parameter control and recipe storage.
    Etching is performed with minimum sidewall deterioration and a high selectivity between materials. With its sleek, compact design, the Samco RIE-10NR system requires minimal clean room space. 

    Dimensions:

    Main Unit: 500(W) x 920(D) x 1510(H) mm

    Pump Unit: 522(W) x 163(D) x 216(H) mm

     Features

    • Highly selective anisotropic etching

    • Fully automatic "one-button" operation with full manual override

    • Easy-to-use computerized touch panel for parameter control, recipe entry and storage

    • Process wafers up to 8" in diameter

    • Sleek, compact design uses minimal clean room space

    Applications

    • Stripping of passivation materials including silicon nitride, silicon dioxide and silicon oxynitride

    • Anisotropic etching of all types of silicon-based films, compound semiconductors and refractory metals including Si, SiO2, Poly-Si, Si3N4, GaAs and Mo

    • Manufacturing of micromachines

    • Failure analysis

  • ICP Etching System RIE-400iP
    Samco's RIE-400iP is a load locked type etching system designed for the precise and highly uniform etching of various semiconductor and dielectric films, and can process up to ø4 inch wafers and smaller pieces....

  • Samco's RIE-400iP is a load locked type etching system designed for the precise and highly uniform etching of various semiconductor and dielectric films, and can process up to ø4" wafers and smaller pieces. Samco's proprietary "Tornado Coil" ICP electrode enables the generation of highly uniform, high density plasma. Users can choose between two ICP sources in order to optimize process results for various materials and applications.

     Features

    • Vertical sidewalls with excellent uniformity
    • Single wafer processing for up to 4" round wafers
    • Tornado ICP allows easy plasma discharge at low powers and pressures
    • Original Vacuum system allows for precise vacuum control and stability
    • Lower Damage highly chemical etching from low ICP powers
    • Active temperature control of sample stage and inner wall of the reaction chamber
    • Interferometric endpoint detection system (optional)

    Applications

    • Fabrication of laser diodes

    • Etching of GaN, GaAs, and InP

    • LD ridge formation

    • Photonic crystal devices

    • Quantum dot devices

  • Plasma-Enhanced CVD System PD-220N
    Samco's PD-220N is highly flexible and supports a wide range of applications, from cutting edge R&D to low volume manufacturing....

  • Samco's PD-220N is highly flexible and supports a wide range of applications, from cutting edge R&D to low volume manufacturing. The PD-220N is a unique Plasma-Enhanced Chemical Vapor Deposition (PECVD) system designed for the deposition of silicon-based thin films (SiO2, Si3N4, SiOxNy, a-Si:H).
    The system offers all of the standard features for PECVD in a very compact footprint. Films with superior thickness and refractive index uniformity can be deposited over a 230mm diameter area, with excellent batch-to-batch repeatability. A computerized touch-panel provides a user-friendly interface for parameter control and recipe storage.
    The Samco PD-220N is ideal for depositing thin film for research and development as well as pilot production applications.
     

    Dimensions:

    Main Unit: 500(W) x 1050(D) x 1510(H) mm

    FEATURES

    • Provides the capacity to process five 3" wafers, three 4" wafers, or one 8" wafer per cycle

    • Uniform deposition rate

    • Fully automatic "one-button" operation time with full manual override

    • Easy-to-use computerized touch panel for parameter control, recipe entry and storage (100 recipes total, 100 steps/recipe)

    • Supports the continuous execution of multiple processes such as cleaning process followed by deposition for greater process flexibility

    • Complete set of system interlocks to protect the system and operator

    APPLICATIONS

    • Deposition of silicon oxide (SiOx)

    • Deposition of silicon nitride (SiN)

    • Deposition of silicon oxy-nitride (SiOxNy)

    • Deposition of amorphous silicon (α-Si:H)


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Other, Power Semiconductors, Semiconductor
If you checked Other, please indicate your Company Industry
InP/GaN Laser Diodes, GaAs VCSEL, SAW/BAW Devices, RF Devices, Failure Analysis, Through silicon via, FOWLP(Fan Out Wafer Level Package), Plasma Desmear.