SUSS MicroTec (Singapore) Pte Ltd

  • Booth: 1404

With more than 60 years of engineering experience SUSS MicroTec is a leading supplier of process equipment for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.
In close cooperation with research institutes and industry partners SUSS MicroTec contributes to key processes for Advanced Packaging and MEMS manufacturing as well as to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit


  • ACS200 Gen3
    Combining expertise with innovation...

  • The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high-volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM. The versatile base frame provides multiple configuration possibilities, e.g. up to 4 wet process modules (either coater and /or developer) with up to 19 plates or 2 wet process modules and 2 spray coater modules with up to 13 plates.

     With the possibility of stacking up to 3 plates over each wet process module and up to 7 plates in the 5th module, the ACS200 Gen3 allows the maximum module count in its class.

  • MA200 Gen3
    Alignment and Exposure for a Multitude of Applications...

  • Especially designed for high volume production the MA200 Gen3 mask aligner is suited for automated processing of square substrates and wafers up to 200 mm. It combines leading-edge 1x lithography technology with a variety of innovative features making it the system of choice for thick resist MEMS applications, 3D patterning over topography and advanced packaging applications such as 3D packaging, fan-out, bumping as well as compound semiconductor and image sensors.

    Special optics ensure outstanding illumination uniformity, and a dose-control mode achieves high wafer-to-wafer stability. Proven mechanical quality results in high-class alignment capabilities making the MA200 Gen3 mask aligner a reliable tool for stable mass-production processes.

    The mask aligner platform is designed for variable process requirements and allows for rapid change-over of optics and quick set-up of special tooling.

  • DSC300 Gen2
    Projection lithography tool for WLP, 2.5D & 3D packaging, bumping and fan-out applications...

  • The projection scanner DSC300 Gen 2 suitable for wafer sizes up to 300mm utilizes latest technologies of projection lithography. The system is designed to meet the requirements for wafer-level packaging, 3D packaging and bumping application and is ideal for emerging packaging applications such as CU pillar bumping and wafer-level chip-scale packaging. With its optical performance, alignment accuracy and high level of automation the system represents the latest projection scan technology. The scanning technique results in excellent image uniformity across the wafer (+/- 3%).

    The technology provides the lowest cost structure in the area of projection lithography solutions available in the market today and complements the existing lithography product portfolio of SUSS MicroTec.

  • XB8
    Universal High-Force Wafer Bonder for MEMS, Advanced Packaging, 3D integration and LED...

  • The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200 mm. All process parameters can be adapted flexibly according to the requirements, which make the system perfect for use in research and development. In production, the high level of automation and the sophisticated design of the XB8 ensure a high level of process stability. This makes the XB8 wafer bonder ideal for applications from the MEMS, advanced packaging, 3D integration and LED fields.

  • XBS200
    Wafer Bonding Platform for High-Volume Production...

  • The universal XBS200 platform allows for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform offers low cost of ownership for high-volume production of MEMS, LED and 3D devices. The XBS200 handles single wafers as well as aligned- and bonded wafer pairs by making use of a novel aligned wafer transfer method. It offers wafer cassette stations with integrated mapping and a camera-based optical pre-aligner with optional ID readers. An optional camera system allows to monitor and record the inside of the machine. A cyclic scheduling algorithm with automated throughput optimization ensures consistent timing of all processes and continuous run capability.

  • HMx Square
    Semi-automated system for single substrate processing for cleaning, developing, etching and resist stripping...

  • The HMxSquare is designed to address the needs of customers in the semiconductor industry requiring high quality substrate processing for photomask applications as well as opto-electronics, OLED, and special semiconductor back-end (MEMS) applications. It offers develop, etch and cleaning functionalities. 

    The HMxSquare is a semi-automated system (manual loading) that enables processing of small series or pilot production of special substrate. It combines stability and reliability of the proven performance of the original HMx series platform with today’s needs for electronic control functions, implementation of new cleaning techniques and environmental and safety requirements.

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MEMS, Photovoltaic, Semiconductor