Especially designed for high volume production the MA200 Gen3 mask aligner is suited for automated processing of square substrates and wafers up to 200 mm. It combines leading-edge 1x lithography technology with a variety of innovative features making it the system of choice for thick resist MEMS applications, 3D patterning over topography and advanced packaging applications such as 3D packaging, fan-out, bumping as well as compound semiconductor and image sensors.
Special optics ensure outstanding illumination uniformity, and a dose-control mode achieves high wafer-to-wafer stability. Proven mechanical quality results in high-class alignment capabilities making the MA200 Gen3 mask aligner a reliable tool for stable mass-production processes.
The mask aligner platform is designed for variable process requirements and allows for rapid change-over of optics and quick set-up of special tooling.