TH1000Si is designed with advanced key technologies to provide high speed, high accuracy, one stop vision inspection solutions specially for BGA, QFN, CSP, TSSOP, MSOP, SOP packages handled in tray. TH1000Si 16 pick up heads contribute to high throughput of up to 42K UPH. Auto pitching mechanism provides faster and more reliable nozzle pitch conversion. TH1000Si is equipped with sorting tray to sort out lead and mark rejects separately. By using 2k x 2k top camera, it performs mark, pin 1, PVI and passive component inspection. It allows to inspect any components mounted on PCB, such as missing components, bad solder joints, position shift, tombstone, chipped off and wrong component.
TH1000Si offers three-in-one inspection, including leaded package inspection, ball package inspection and leadless package inspection, which can reduce maintenance costs, as well as mark and package inspection. TH1000Si is able to inspect various types of 2D and 3D defects for various package sizes with high- speed, high accuracy and low false call.