The Bondjet BJ855 is the successor of the proven Bondjet BJ820, the world's leading fully automated fine wire wedge-wedge wire bonder.
■ Optimized pattern recognition (PR)
■ Software features for the growing demand of connectivity and
industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, ...)
■ Hesse Assist Tools: load cell, bondtool and wire spool detection, bond tool calibration without wedge gauge for operator independency
The Bondjet BJ855 is ready for all wire bonding challenges on a single platform, using wires and ribbons of all common materials.
Typical applications are components in RF technology, COB, MCM, hybrids, optical and automotive electronics.
In addition to a standard configuration, Hesse offers automation concepts individually adapted for every application.