Cohu Malaysia Sdn. Bhd.

Melaka,  Melaka 
Malaysia
http://www.cohu.com
  • Booth: 801

Cohu is a publicly traded (NASDAQ: COHU) global company with headquarters in Poway, CA and is a global technology and market leader in $5 billion1 Semiconductor and PCB Test and Inspection Markets. We create leading-edge solutions for back-end semiconductor equipment and services, and printed circuit board test.

Cohu offers the broadest portfolio of equipment and services for back-end semiconductor manufacturing, including a one-stop shop for test and handling equipment, thermal subsystems, test contacting, vision inspection and MEMS test solutions.

Our enhanced product portfolio gives our customers the best possible combination of technologies to match their business and technical needs, focused on increasing yield, reducing cost of test and accelerating time-to-market.

Main Products

Test Handler Group (THG): designs and manufactures pick-and-place, gravity feed, test-in-strip handlers; MEMS test units; and turret-based test handling and back-end finishing equipment for ICs, LEDs and discrete components.

Semiconductor Test Group (STG): designs and manufacturers automated test equipment (ATE) or “testers”, which are scalable platforms targeted at testing ASSP, MCU, RF PA/FEM, Sensors/MEMS and Power and Analog devices.

Interface Solutions Group (ISG): develops and manufactures integrated solutions that interface with our products, including cantilever and high-performance contact sockets, test contactors, probe and spring pins.

(1) Company and VLSI estimates


 Products

  • Infra-Red Module
    Module for enhanced micro-crack and sub-surface defect detection on wafer-level chipscal packages (WLCSPs)....

  • Infra-Red imaging has the ability to see through silicon, inspecting the structure underneath the surface that is not otherwise observable with traditional vision inspection systems. Cohu's vision module offers a breakthrough by integrating infra-red imaging onto a high-speed automation platform that delivers an economical solution for high quality inspection. This module, in combination with previously announced Aquilae inspection and 3D Flex metrology, further strengthens Cohu's differentiation in the growing semiconductor inspection market.

  • cCompact Contactor
    Ideal for Multisite Testing of Analog and Smart Power Device Requiring Kelvin Test. Innovative High Density Socket Architecture for High Parallelism Applications....

  • High Productivity:

    • Extremely long cleaning interval
    • Easy single pin replacement
    • Very long pin life due to use the Denmark Alloy

    Key Features:

    • Reduced site to site pitch concept enables high parallel test for power applications on Strip test and Pick&Place handler platforms
    • Outstanding CRES stability
    • Smallest pitch: 0.40 mm
    • Static connection to load board
    • Current carrying capability 2.5 A
  • xWave Contactor and ProbeHead
    Broadband Production Solution for cmWave and mmWave up to 100 GHz. ...

  • Benefits:

    • Lab and volume production test
    • Backhaul cellular netowrk applications
    • WiGig and WirelessHD applications
    • Automotive radar applications
    • BGA, fBGA, LGA, QFN, WLCSP
    • Pitches down to 0.3 mm (handler), 0.15 mm (prober)

    Key Features:

    • Shortest impedance-matched RF path
    • Minimized number of signal transitions
    • Solder-down performance
    • Proven in production > 1.5 M cycles on handler
    • Integrated assembly available
  • cHybrid Turret Contactor
    For Leaded and Leadless Devices Down to 0.3 mm x 0.6 mm. ...

  • High Productivity:

    • New Denmark pin material
      - Prevents solder migration
      - Long cleaning intervals - 50,000 cycles
      - For pure pin
      - Lifetime more than 1 million cycles
    • No load board wear
    • Fast application board exchange without socket adjustment
    • Singe pin replacement drives cost of test significantly down
    • Short index time due to innovative socket & system integration

    Key Features:

    • Kelvin / none Kelvin configuration available
    • Side-by-side for very small pad sizes
    • Smallest device size 0.3 mm x 0.6 mm
    • Insertion loss 5 GHz @ -1 dB (S21)
    • For QFN, DFN, SO, SOT devices
    • Compact multi-beam pin structure for high density system integration
  • cViper ProbeHead Contactor
    High Performance ProbeHead for High Volume Production Test....

  • Benefits:

    • Lab and volume production test
    • Singulated devices or wafer-level test
    • Low and stable contact resistance
    • Bandwidth up to 27 GHz

    Key Features:

    • Low loop inductance and high bandwidth
    • Device pitch down to 100 µm
    • Variety of contact materials to optimize performance
    • Manual actuation of singulated devices
  • cDragon Contactor
    For Mixed Signal, Precision Analog and RF Applications. Excellent RF Performance with Low Cost of Ownership....

  • High Productivity:

    • Elastomer-free design for long life
    • Very easy to maintain
    • Pin replacement in <5 minutes
    • No loadboard wear & tear
    • Industry leading long lifetime
    • Extremelty long cleaning intervals

    Key Features:

    • Revolutionary single spring & small from factor design
    • Very low loop inductance & high bandwidth
    • Outstanding CRES stability
    • Insertion loss 22 GHz @ -1 dB
    • Inductance 0.43 nH
    • Smallest pitch available 0.30 mm
    • Wide package range SO, DFN, QFN, QFP
    • Temperature range -55 °C to +155 °C
    • Constant contact force at each temperature setpoint
    • Best temperature accuracy by multi-beam contact spring architecture

 Additional Info

New Exhibitor:
No
New Products:
No
Displaying Equipment:
Yes
Product Demonstrations:
Yes
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Semiconductor
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