Teratech Solutions Pte Ltd

  • Booth: 120

Teratech Solutions, a provider of Equipment, FA Tools, etc.

Teratech Solutions is a provider for Advanced Semiconductor Manufacturing Equipment, Failure Analysis Tools, Precision Tooling, Spare Parts & others.

Advanced Manufacturing Equipment & others:

  1. Shibuya: Micro-Solder Ball Placement Equipment for Array & Wafer Level Package (capable of copper pin/column mounting on wafer), High Accuracy Flip-chip bonder
  2. BondTech: Surface Activation Bonder (low temp bonding) for Chip-on-Chip/Chip-on-Wafer for 3D LSI (TSV), LED, Optical Device, MEMS packaging, etc
  3. Nomura: CO2 Bubbler
  4. Rix: Water Jet Deflashing System, Micro Ice Jet Nozzles
  5. Saw Singulation Jig for Package/BGA/QFN singulation system
  6. Diamond Saw Blades for BGA/QFN Singulation
  7. High Precision Mold Chase, Punch Tool (Die Set), Jigs & Spare Parts
  8. High quality ceramic chuck for dicing & back-grind process

Failure Analysis & Advanced Metrology Solutions:

  1. Hitachi: Scanning Acoustic Microscope for Semiconductor devices such as TSV, WL-CSP, Advanced Flip-chip Inspection, etc.
  2. Hamamatsu: Electrical Fault Isolation Tools (Photon Emission, Laser Techniques OBIRCH, Thermal Emission Microscopy, Electro Optical Probing/Frequency Mapping)
  3. Hamamatsu: Infra-red Microscopy Camera

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