Hachioji City Tokyo, 
  • Booth: 404

Most advanced leading-edge product developper in SPE.

Tokyo Seimitsu Co.,Ltd. (Accretech), is proud to demonstrate "AD20T", The revolutionary axis design orientation creates the smallest twin spindle dicing saw. We also display Polish Grinder "PG300RM" which simultaniously grind wafer backs and remove damage to produce a wafer of the required thinnness, Wafer proving Machine "UF3000EX" a next-generation high-spec model that world No. 1 supplier of proving machine presents with 100% confidnce and "A-WD-300TX, the full automatic wafer dicing machine with the face-to-face twin spindles, ready for high throughput and high process quality.

For Technical Support with this webpage, please contact support.