CEI Limited

Singapore, 
Singapore
http://www.cei.com.sg
  • Booth: 228


Welcome to visit our booth to discuss how we can help you.

CEI Limited was listed on the main board of the Singapore Exchange in March 2000.


The Company provides printed circuit board and box-build assembly, equipment design, cable harness assembly and manufacturing services.

CEI design and build own CEI brand equipment such as wafer uv eraser, sorter/packing & unpacking systems, macro and micro inspection systems, 3rd optical inspection machines, AGV/mobile robot material handler and custom automation system with a focus on the semiconductor industry.


CEI is Headquartered in Singapore with manufacturing sites in Singapore, Batam (Indonesia), Ho Chi Minh City (Vietnam) and Shanghai (China).


 Products

  • CEI AER681/AER682
    CEI AER681/AER682 WAFER UV ERASER SYSTEM...

  • Applications:

    Complete erasing of charges of EPROM and Flash Memory.

    UV Curing and Hardening.

    Removal of stress induced due to manufacturing processes.

    Features:

    Fully automated UV Eraser System for 150mm and 200mm wafers.

    High Power UV Lamo with intensity 60 mW/cm sq.

    Wafer Robot Handling.

    Statistical Process Control.

    Multi-wafer UV Chamber with high throughput.

    Input/Output - Cassette or Load Port.

    SECS/GEM communication.

    OCR - Optical Character Reader.

    Cassette to Cassette Transfer (AER682).

    Wafer aligner & OCR (Option) (AER682).

  • CEI AWL681/AWLM681
    CEI AWL681/AWLM681 OPTICAL INSPECTION STATION WITH INKLESS BINNING FOR 200MM WAFERS...

  • Applications:

    Macro and Micro Optical Wafer Inspection and Review System.

    Wafer Transfer / Sort with OCR System.

    Features:

    Automatic robotic wafer handling 150mm and 200mm wafers.

    Capability to handle thin wafer (> = 6 mils).

    Multi functions: Cassette to Cassette Sort, Cassette to XY Stage for Micro Inspection.

    Inkless binning catered to handle all Semi Standard Map format.

    Macro Tilting & Spin Module to inspect frontside, backside & edge.

    Capable to integrate with any OEM Optical Microscope.

    Optical Character Reader (OCR) capability.

    SECS/GEM (Option).

    Wafer Aligner (Option).

  • CEI BTC681/BTC682
    CEI BTC681/BTC682 WAFER SORTING SYSTEM...

  • Application:

    Wafer sorting / packing & unpacking.

    Features:

    Flexible to handle wafer from 150mm & 200mm.

    Capable of handling wafer thickness from 6 mils to 29 mils.

    SECS/GEM communication.

    Enable full wafer integrity and traceability.

    Eliminate human handling.

    Reduces wafer loss and improve yield.

    Safe, automated environment.

    Macro Inspection.

  • CEI BTC682( T )/BTC682( U )
    CEI BTC682( T )/BTC682( U ) THIN/THICK WAFER SORTING / PACKING & UNPACKING SYSTEM...

  • Applications:

    Thin / Thick Wafer sorting / packing & unpacking.

    Features:

    Capable to handle 150mm and 200mm wafers.

    Capable to handle 3 mils to 29 mils (Using Bernoulli's Arm and Vacuum Arm).

    Capable to handle 13/12/25 slot cassette / canister / jar.

    Macro Inspection using camera (Backside Inspection).

    Built in Aligner (camera based) / OCR Reader.

    Enable Full Integrity and Traceability.

    Eliminate Human Handling.

    Reduce wafer loss and improve yield.

    Safe Automated Environment.

    SECS/GEM communication.

  • CEI BTC8121
    CEI BTC8121 WAFER SORTING SYSTEM...

  • Applications:

    Wafer sorting / packing & unpacking.

    Features:

    200mm and 300mm wafer handling capability.

    Class 10 cleanliness.

    Modular design for future expansion.

    Capable of handling thin wafers of 12 mils.

    SECS/GEM communication.

    Enable full wafer integrity and traceability.

    Eliminate human handling.

    Reduces wafer loss and improve yield.

    Safe, automated environment.

  • CEI OPT654(F )
    CEI OPT654(F ) 3rd OPTICAL INSPECTION MACHINE...

  • Applications:

    3rd Optical Inspection Machine with Auto Conversion.

    Post die attached, wire bond inspection.

    Package - Leadframes, Substrates, Boats.

    Features:

    One touch auto package conversion.

    Strip mapping with defect codes.

    Graphic User Interface (GUI) with SPC report.

    Reject Identification - Wire Breaker, Bottom Scribing (linear/rotary), Ink Dispenser.

    Options:

    2D Matrix code reader.

    Networking capability.


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which industries/technologies your company serves
Semiconductor
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