Nakano-ku,  Tokyo 
  • Booth: 935


  • Wafer Both Side Pattern Inspection
    Wafer Both Side Pattern Inspection...

  • Wafer size : Maxφ12inch
    Measurement position: 25 points  (Both side)
    Throughput(Top-Bottom):    Top-Top: 100pcs/1h    Top-Bottom : 100pcs/1h
     *Measurement point 5 points
    Measurement repeatability:
    10X Objective Lens:  0.2um/3σ
    50X Objective Lens: 0.02um/3σ
    Option: Noncontact wafer handing (Bernoulli chuck)
  • Micro Solder Ball Jisso Inspection and Repair
    Micro Solder Ball Jisso Inspection and Repair ...


    Substrate size:   PCB    Max 500×500mm

    Wafer Max φ12inch

    Solder ball : φ40~φ500um

         *Option---Solder ball size Min φ20um

    Throughput :

    Inspection 20sec→Solder ball repair 3sec or less

         *ubstrate PCB(Size: 300×400mm)

         *One missing ball repair

    Available for in-line manufacturing system

  • Wafer Review Station
    Wafer Review Station ...


    Wafer size : 8inch -12inch

    Wafer state : Only wafer

             Wafer with dicing ring

    Measurement repeatability :±20um/3σ

    Review system: magnigication2.5X-100X


                      ※Defect 100 points /1Wafer

    Review(Move-AF) 0.5sec

           *AF=Auto Focus System

  • Wafer Exposure /Mask Aligner
    Exposure Equipment For CMOS, Power Device, MEMS, LED (PSS) Product ...


    Wafer size  :φ2inch -φ12inch

    Alignment  :One side /Both side(Accuracy±1m)

    Lamp wavelength :365nm

    Resolution    : L/S=1um/1um(Vacuum contact)

 Additional Info

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Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor
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