We provide the best solution for your measurement system.
We provide a new system to measure the material film thickness of wafer surface. Including PR, oxide film, and/or nitride film. Besides a new metrology, we also promote a machine vision system with AI solutions to help the customers improving the quality control of production.
Name your Metrology needs and we will provide the best solution
OVERLAYCHEK, Auto Optical Inspection (AOI) equipment capable of measuring critical dimensions (CD) and overlay shift.
The best choice for increasing quality and reducing time efficiently during mask alignment and the etching process.
We can do
1. Non-contact model profiler
2.High-speed catch the whole area FOV
3.Nanometer high resolution
4.3D color dsiplay profile
5.Wafer flim stress analysis
6.Wafer surface defect display
find out more please visit us at booth 418
