Saint Jeoire, 
  • Booth: 212

Visit us to discover our latest bonding innovations !

Founded in 1975, SET - Smart Equipment Technology - based in Saint-Jeoire, France, is a world leading supplier of High Accuracy Die-to-Die and Die-to-Wafer Bonders and versatile NIL solutions.

We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

As a supplier of semiconductor equipment dedicated to high precision applications for over 40 years, SET has developed more than 34 different types of equipment. With more than 300 Device Bonders installed worldwide in more than 30 countries, SET is globally renowned for the unsurpassed sub-micron accuracy and the high flexibility of its die and flip-chip bonders.


  • ACCμRA M
    The ACCμRA M is a manual flip-chip bonder that allows ± 3 μm post-bond accuracy. This equipment permits to align manually the components with a high level of precision....

  • The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.

    It is the perfect equipment for universities and R&D institutes.

    The ACCμRA OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy. It is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of your process. ...

  • The ACCμRA OPTO combines high precision, flexibility and accessibility.

    It is the perfect equipment for optoelectronics and silicon photonics applications.

  • ACCμRA100
    The ACCµRA100 is a semi-automatic flip-chip bonder that guarantees +/- 0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range of applications. ...

  • The ACCµRA100 combines high precision, accessibility and cost-effectiveness.

    It is the perfect equipment for universities and R&D institutes.

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