Component Technology Pte., Ltd.

Singapore,  Singapore 
  • Booth: 104

Leading Supplier of Post Wire Bond

Through clear understanding of customers’ needs and expectations we provide cost-effective solutions for their production requirements. Main products represented are: In.D Solution, High speed automatic post die and wire bond inspection system. This is the world first automatic high speed high accuracy 3D inspection and measurement system. Post wafer saw surface inspection system, an automatic system that provides die surface inspection after wafer sawing process developed for back-end. Camera monitoring modules for real-time in-line production monitoring purposes.

At this show, we will showcase our Reel-to-Reel Vision Inspection Machine model Qi100. It has enhanced process control and measurement capabilities.

 Additional Info

New Exhibitor:
New Products:
Displaying Equipment:
Product Demonstrations:
Please indicate which industries/technologies your company serves
For Technical Support with this webpage, please contact support.