Welcome to the Evatec Thin Film Powerhouse
Evatec delivers complete thin film production solutions for Advanced Packaging, Power Devices, MEMS, Wireless Communication, Optoelectronics and Photonics. Choose from our range of batch, cluster and inline platform architectures for deposition of metals, TCOs, dielectrics and a whole range of compounds according to your process, throughput and factory integration requirements.
From the deposition of next generation AlScN piezoelectric materials enabling 5G on CLUSTERLINE to cost effective high performance EMI shielding processes on SOLARIS and perfect "lift off" solutions on the BAK Evaporator, our production tools offer proven reliability and flexibility for some of the longest lifetimes in the industry.
In Advanced Packaging , HEXAGON and CLUSTERLINE deliver high yield UBM/RDL processes with stable low Rc values at throughputs of up to 56wph in Fan-Out Wafer Level Processing ( FOWLP) . Combining our atmospheric batch degas, etch and deposition technologies achieves even lower Rc values needed for contacts and interconnects for power management in upcoming IOT applications. Knowhow from FOWLP combined with capability in panel handling now enables Evatec to deliver high yield Fan-Out Panel Level Process ( FOPLP) solutions too.
In Photonics we deliver complete soltions for the production of high performance optical components used for Face recognition and 3D sensing in smart consumer devices on CLUSTERLINE RAD.