Component Technology Pte., Ltd.

Singapore,  Singapore 
  • Booth: 104

Leading Supplier of Post Wire Bond

Component Technology Private Limited, incorporated in Singapore on 11November 1989.

Through continuous innovation with customers’ requirement as our focus, we aim for breakthrough innovation.

We have built good relationships with global leading automotive electronics and high-end semiconductor IDMs and OSATs.

Leveraging on technology, quality, cost, service and delivery we have achieved customer satisfaction.

Our vision solutions include wafer inspection, leadframe measurement and inspection, die and wire bond inspection, moulded package
inspection and x-ray image analyser.


  • Automatic Vision Inspection System (IV-T3300)
    Automatic 2D and 3D Vision Inspection machine for wire bonds and other surface defects. Large working area for inspecting different types of semicon packages, modules or PCB assemblies....

  • Key Features:

    Clean and Simple Design for Easy Maintenance

    Flexibility to Dock with Different Material Handling Systems:

    • JEDEC Tray
    • Waffle Pack
    • Nikko Rack
    • Carrier Boat
    • Lead Frame
    • PCB Assembly

    Large Inspection Area of 600 mm X 550 mm

    Available in Single or Dual Track Loading Option

    Unique Ergonomic Access Door Design

    Touch Screen Monitor for Easy Operation

    SECS/GEM Communication

  • Automatic Wafer Inspection System (IV-W2000)
    Automatic inspection machine for Wafer defects designed for Semicon backend manufacturing. Ergonomic, compact and space saving design....

  • Key Features:

    Automatic Wafer Handling of Wafer after Saw Process

    Automatic Alignment of Wafer before Inspection

    Inspects Sawn and Unsawn 6; 8; 12 inches Full and Partial Wafer or Wafer by Region

    WPH < 3 mins Full Inspection < 2um Resolution

    Software Rotated eMap Display

    Customized eMap Configuration

    Manual Review of Inspection Result

    User Defined Reject Bin Code

    Touch Screen Monitor for Easy Operation

    SECS/GEM Communication

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