QES (Asia-Pacific) Sdn Bhd

Shah Alam, Selangor,  Selangor 
  • Booth: 312

Welcome to QES Group of Companies!

QES was founded in Oct 1991. We specialise in manufacturing, distribution and provision of engineering services for inspection, test, measuring, and automated handling equipment. QES Group of companies has since grown into a leading integrated solution provider with manufacturing capability.
The Group has 2 core business division:
  • Distribution Division
  • Manufacturing Division

Our successful ingredient is always customer driven. It is vital for us to constantly seek the best solution to suit our customers’ requirements.
QES Group has a strong direct presence through subsidiaries and affiliates in ASEAN countries and Malaysia, Singapore, Thailand, Indonesia, Philippines, Vietnam and Hong Kong (China). For the rest of the world, QES Group’s products are marketed and supported through a network of worldwide distributors and representatives.


  • Post Wire Bond Inspection System PWB2000V
    PWB2000V is an automated, reliable and effective solution for post die attach and post wire bond inspection....

    • Auto 2D Vision Inspection Tool for 3rd Optical Application
    • Multiple Magazine Loader & Dual Scanning Track Mechanism
    • Capable of Store Maximum up to 5 Magazines (90mm Width Each)
    • Capable to Handle the Maximum Dimension of Sample up to 100mm (Width) x 300mm (Length)
    • High Resolution of Camera Up to 8.9MP  
    • Defect Classification based on 4 Vision Tools
    • Lighting Type by using Dome Light Ultra Bright for Stroboscope
    • On-the-Fly Vision Scanning with Stroboscopic Control
    • Programmable Recipe Control and Strip Mapping Capability 
  • Wafer Packing System WPS3800
    WPS3800 is designed to handle 8” & 12” Wafer size for packing & unpacking process from various type of shipping carriers....

    • Designed for 8” & 12” wafer
    • Comes with 2 x FOUP/FOSB for 12” wafer and Open Cassette for 8” wafer with integrated Wafer Protrusion Detection Sensor and Thru-Beam Wafer Mapping
    • 2 x Universal Shipping Carrier Station for various type of Canister and Wafer Jar with auto-detection for 8” & 12” wafer size
    • 1 x Interleaf Paper Port (Auto-conversion between 8” & 12” Paper)
    • Built-in Hirata Wafer Pre-Aligner (8 & 12” wafers)
    • Hirata 4-axis ATM robot with flip axis (Radius-Theta-Height-Flip Axes)
    • 2-axis Cartesian Robot with Bernoulli Technique to handle Interleave Paper & Wafer
    • Built-in Vision System for wafer, interleave paper or spacer detection
    • Built-in Height Sensor for accurate robotic handling
    • TCP-IP & RS232 data interfaces/ SECS/GEM data communication (Optional)
  • 1st Optical Inspection System WIS1000
    WIS1000 is designed to handle 6” wafer and 8” wafer size. The standard designed comes with one standard load port which can accommodate the 6” SEMI Standard Open Cassette and 8” SEMI Standard Open Cassette....

    • Designed for 150mm & 200mm Wafer
    • Micro & Macro Inspection (Including Back Macro)
    • Bright-Field, Dark-Field and NIC Modes
    • Integrated with Nikon Autoloader & Microscope
    • Motorized Objective Lens With 4 Objectives Lens (5x, 10x, 20x, 50x)
    • Integrated with Wafer Ionizer and Programmable XY Indexing
    • Wafer Alignment & Wafer Mapping Capability
    • User-defined Reject Code & Summary Lot Report after Inspection
    • Integrated with Inker For Defects Marking (Optional)
    • Software UI with Recipe Control Module, Wafer Map, Cassette Map and Microscope Components 'Control
  • Wafer Batch ID Reader System WID150R
    WID150R is suitable for 6” SEMI Standard 25 Slots Open Cassette and it comes with built-in programmable wafer orientation flat alignment in order to ensure the wafer in a right orientation before scanning the ID....

    • Designed for 6” Wafer
    • 1x Open Cassettes Station (Based on sample cassette provided)
    • Cassette Orientation Sensors (Detect reverse placement of cassette) and Cassette “Present” and “Tilt Sensors.
    • In-cassette wafer slot mapping function
    • Wafer orientation flat alignment mechanism integrated.
    • Programmable wafer rotation for various wafer ID locations.
    • Batch wafer ID reading (Front & Back with the wafer ID on orientation flat area)
    • Recipe controlled mapping, alignment & wafer ID reading.
    • TCP-IP & RS232 data interfaces/ SECS/GEM data communication (Optional)
  • Scanning Acoustic Microscope VUE 250-P
    The VUE 250 Single Channel is the latest in scanning acoustic microscope technology. It offers flexibility for both your production and lab departments. The system's scan axis is maintenance free while the step and focus axis is low maintenance....

  • Key Benefits
    • Real-time A-scan & B-scan & SLICE
    • A-scan Capture 
    • Frequency Domain Imaging (FFT)
    • Advanced Time-of-Flight & Thickness Measurements
    • C-scan with Multi-gate (SALI & SALI Groups)
    • Cluster Analysis (post-processing)
    • Threshold Mapping (post-processing)

    • Motor: Linear Servo
    • Max Velocity: 500mm/s
    • Accuracy: ±1.0µm
    • Repeatability: ±1. 0µm
    • Scan envelope: 250mm
    • Step envelope: 150mm
    • Focus envelope: 35mm
  • TSP Standard Series Voltage Sag Protector
    TSP Standard Series Voltage Sag Protector...

    • Maintaining manufacturing facilities as a normal state when the 1-second momentary power interruption occurs.
    • When manufacturing automation equipment, Power vaccine Standard Engineering Solution will be reflected as a no-battery design specification for the tolerance enhancement to the electric virus like 1-second momentary power interruption.
    • Project activity a stable work environment in the manufacturing process.
    • TSP® is a differentiated product from with which integrates voltage sag compensation and monitoring system, and it offers in power energy integrated control system construction of Power Info-Net™ 

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