Teratech Solutions Pte Ltd
Teratech Solutions, a provider of Equipment, FA Tools, etc.
Teratech Solutions is a provider for Advanced Semiconductor Manufacturing Equipment, Failure Analysis Tools, Precision Tooling, Spare Parts & others.
Advanced Manufacturing Equipment & others:
- Shibuya: Micro-Solder Ball Placement Equipment for Array & Wafer Level Package (capable of copper pin/column mounting on wafer), High Accuracy Flip-chip bonder
- BondTech: Surface Activation Bonder (low temp bonding) for Chip-on-Chip/Chip-on-Wafer for 3D LSI (TSV), LED, Optical Device, MEMS packaging, etc
- Nomura: CO2 Bubbler
- Rix: Water Jet Deflashing System, Micro Ice Jet Nozzles
- Saw Singulation Jig for Package/BGA/QFN singulation system
- Diamond Saw Blades for BGA/QFN Singulation
- High Precision Mold Chase, Punch Tool (Die Set), Jigs & Spare Parts
- High quality ceramic chuck for dicing & back-grind process
Failure Analysis & Advanced Metrology Solutions:
- Hitachi: Scanning Acoustic Microscope for Semiconductor devices such as TSV, WL-CSP, Advanced Flip-chip Inspection, etc.
- Hamamatsu: Electrical Fault Isolation Tools (Photon Emission, Laser Techniques OBIRCH, Thermal Emission Microscopy, Electro Optical Probing/Frequency Mapping)
- Hamamatsu: Infra-red Microscopy Camera