Welcome to the "Thin Film Powerhouse".
Evatec delivers complete thin film production solutions for Advanced Packaging, MEMS, Power Devices, Wireless Technologies, Optoelectronics & Photonics. We offer a range of batch, cluster and inline platform architectures for deposition of metals, TCOs, and dielectrics according to your production throughput and fab integration needs. Evatec Advanced Process Control (APC) technologies maximise throughput and process yield.
From the sputter deposition of next generation AlScN piezoelectric materials enabling 5G on CLUSTERLINE® to high throughput metallization solutions on 8inch in our BAK Evaporators, visit our booth to find out how our production tools can help you solve your production challenges in MEMS and Wireless Communication.
Within Advanced Packaging our latest HEXAGON and PNL tools are optimised for handling of highly outgassing substrates at wafer or panel level, whilst our latest portfolio of production solutions for Optoelectronics drive down your costs for deposition of ITO, mirrors and contacts in production of LED, VCSEL and Micro Display.
You can read more about industry trends and process capabilities across all Evatec core markets in our technology magazine "LAYERS". Read the magazine online or come to the booth to get your own printed copy.
We look forward to welcoming you to our booth.