Component Technology Pte., Ltd.
Leading Supplier of Wire and Die Bond Inspection Machine
Component Technology Private Limited, incorporated in Singapore on 11 November 1989.
Through continuous innovation with customers’ requirement as our focus, we aim for breakthrough innovation.
We have built good relationships with global leading automotive electronics and high-end semiconductor IDMs and OSATs.
Leveraging on technology, quality, cost, service and delivery we have achieved customer satisfaction.
Our vision solutions include wafer inspection, leadframe measurement and inspection, post wire and die bond inspection, moulded package
inspection and x-ray image analyser.