ECORELTM HT 296T-85 is No Clean solder pastes with high lead content (Pb92.5Sn5Ag2.5) designed and formulated for the die-attach process in power semiconductors and high temperature assembly of micromodules and embedded systems.
The printing capabilities of these solder pastes allow an excellent abandon time, and long steady tackiness.Good wettability on Ni, NiP, and Cu lead frames with low percentage of solder voids and excellent flux residue cleanability.