Inari Amertron Berhad ("Our Group" or "The Group") is principally involved as an outsourced semiconductor assemly and test (OSAT) service provider for Radio Frequency (RF), Fiber-optics transceivers, Opto-electronics, sensors and custom IC technologies. Our Group's major undertakings include:
- Wafer processing covers probing, laser marking, die sawing, back grinding, flip-chip dice tape & reel and automated visual inspection (AVI).
- Chip Fabricaion and Wafer Certification in Fiber Optic chips covering wafer scribe & cleave, bar aligning, demount-load fixtures and facet coating and chip on carrier (COC)
- Advanced System in Package (SIP) assembly and test include fine-pitch surface mount technology (SMT), high speed & high accuracy flip-chip dice placement, in line post vision, molding under fill (MUF) and post mold oxide plating, and final testing.
- Other services include Sensor and IC Package design and characterisation, process customization and assembly, product testing, box build and direct customer drop-ship.
The Group operates 10 plants situated regionally across three countries namely Malaysia, Philippines and China with facilities totalling floor space of more than 1,8000,000 square feet, and with a workforce of more than 5,000 spread across the region.
Our Group takes a holistic approach in executing our growth plans strategically as we continiously explore opportunities to expand through value-accretive investments in production capacity and technolgoy innovation, enhancing capabilities and manufacturing processes, nurturing a strong talent pool, incorporating sustainability measures and implementing best practices across our operations and organizational structures.