Regional Business Network

  • Booth: N509

Regional Business Network Pte Ltd. Product & Services We serve the semiconductor wafer fab & advanced wafer level packaging (WLP, WLCSP, eWLB, Flip Chip Bumping & TSV) industry specialize in the following area:

1) Wafer Metrology & Inspection Equipment – Si/Glass thickness, Thick Film/PR layer thickness, CD, Roughness, 2D/3D Profiler, XRF, TXRF, Resistivity 4 Point Probe System.

2)Dry/Wet Etch, Thin Film Deposition process Equipment – Single wafer, batch process clean, PR-strip/Metal etch, CVD/PVD/PECVD/Plasma-RIE

3)Wafer Handling Equipment – Fully Automated Taping, Detaping(UV), Mounting/De-Mounting, Bonding, OCR/Barcode reading/printing & ultra-thin wafer transfer sorter

4)Specialty Materials & Chemicals (metal etch and photoresist strip)


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