ZEISS Xradia 620 Versa
3D X-ray Microscopy for Faster Sub-Micron Imaging of Intact Samples
ZEISS Xradia Versa 3D X-ray microscopes (XRM) are the benchmark in non-destructive failure analysis and product verification for semiconductor packages with buried features, including:
• 2.5D interposers
• High bandwidth memory and VNAND
• Stacked chips with TSVs
• All types of flip chip and microbump interconnections
• Wafer-level packages and packageon- packages
High-resolution Non-destructive 3D X-ray Imaging
• Capture high-resolution cross-section images and tomographies of fault locations and buried features without cutting the samples
• View images from any orientation, in their native state, using interactive virtual cross-sections
• Obtain unsurpassed performance for high-resolution imaging at long working distances in packages, circuit boards and 300 mm wafers
Versatile for all Package Types
• Reduces the need for traditional failure analysis such as cross-sectioning
• Increases the success rate of physical cross-sections, when needed, by more precisely identifying defect locations
• Enables measurement of buried structures within the imaged volume from any optimal plane
• Reveals submicron structural changes within samples during multiple reliability test cycles and read-points, while leaving the samples intact
Versatile for all Package Types
• Reduces the need for traditional failure analysis such as cross-sectioning
• Increases the success rate of physical cross-sections, when needed, by more precisely identifying defect locations
• Enables measurement of buried structures within the imaged volume from any optimal plane
• Reveals submicron structural changes within samples during multiple reliability test cycles and read-points, while leaving the samples intact