SVCS Process Innovation s.r.o.

Brno, 
Czech Republic
http://www.svcs.eu
  • Booth: C17


Front-end Semiconductor equipment from the Heart of Europe

                                                                                                                      

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Our experience is based on a long history and tradition of the semiconductor industry in former Czechoslovakia, in a place called the Czech Silicon Valley.

For over 22 years we have been striving towards development of the tomorrow’s tools and tomorrow’s process innovations. To do this successfully, we cooperate with leading R&D laboratories, universities and scientific institutes.

The company’s headquarters and production plant are located in the Czech Republic. We have world wide network of business representatives, including SVCS Service Centres in China, India, Russia and the USA.

SVCS has delivered installations for customers all over the Planet, for example: Australia, Belarus, France, China, India, Japan, Korea, Lithuania, Malaysia, Poland, Russia, Slovakia, Taiwan and the USA.
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 Products

  • Horizontal Furnaces
    Designed for High Performance in Production Environment while stays Efficient and Economic...

    • Atmospheric Processes

    • Diffusion (drive-in) high temperature procesess
    • Doping from solid, liquid and gaseous dopant sources e.g.: BBr3, B2H6, POCL3, PH3, BN
    • Various thermal processing e.g. annealing, sintering
    • Pyrogenic Wet Oxide with External Burning System
    • Wet Oxide with ultra pure steamer
    • Dry Oxide
    • HiPOx (High Pressure Oxide)

    LPCVD Processes

    • Silicon nitride
    • Low temperature oxide (LTO)
    • High temperature oxide (HTO)
    • TEOS oxide
    • Polysilicon, with tilt/flat temperature profile
    • Doped polysilicon
    • Oxynitride

    PECVD Processes

    • Silicon nitride (incl. anti-reflective SiN solar cell coating)
    • Silicon oxide
    • Oxinitride

    ​
    DCE or HCl optional for all processes

  • Vertical Furnaces
    Scalable for Production or R&D Applications...

    • Features and Benefits

    • Automatic wafer handling system for loading wafers from SMIF or FOUP closed pods
    • Special automatic loading system which allows loading wafers from open cassettes and provides an exceptionally small footprint
    • Quartz or SiC boats can be used 
    • Highly tailored state of the art modular control system, in house designed and manufactured
    • 10,4“ high-res touchscreen for operator interface

    Atmospheric Processes

    • Diffusion (drive-in) high temperature procesess
    • Doping from solid, liquid and gaseous dopant sources e.g.: BBr3, B2H6, POCL3, PH3, BN
    • Various thermal processing e.g. annealing, sintering
    • Pyrogenic Wet Oxide with External Burning System
    • Dry Oxide

    LPCVD Processes

    • Silicon nitride / low stress nitride
    • Low temperature oxide (LTO)
    • High temperature oxide (HTO)
    • TEOS oxide
    • Polysilicon, with tilt/flat temperature profile
    • Doped polysilicon
    • Oxynitride

    DCE or HCl optional for all processes

  • Compact Tabletop Furnaces
    Unique Compact Design, All Features of the Grown-up Furnace...

    • Atmospheric Processes

    • Diffusion (drive-in) high temperature procesess
    • Doping from solid, liquid and gaseous dopant sources e.g.: BBr3, B2H6, POCL3, PH3, BN
    • Various thermal processing e.g. annealing, sintering
    • Pyrogenic Wet Oxide with External Burning System
    • Wet Oxide with ultra pure steamer
    • Dry Oxide
    • HiPOx (High Pressure Oxide)

    LPCVD Processes

    • Silicon nitride
    • Low temperature oxide (LTO)
    • High temperature oxide (HTO)
    • TEOS oxide
    • Polysilicon, with tilt/flat temperature profile
    • Doped polysilicon
    • Oxynitride

    PECVD Processes

    • Silicon nitride (incl. anti-reflective SiN solar cell coating)
    • Silicon oxide
    • Oxinitride

    DCE or HCl optional for all processes

    Features and Benefits

    • Ideally suited for R&D labs and pilot fabs
    • Small footprint
    • Table or standalone solution (with stands)
    • Stackable desing (e.g. double tabletop variant)
    • Low power consumption
    • Easy operation and maintenance
    • Heating element with 1 or 3 temperature zones and max. temperature up to 1300 °С
    • Modern modular proprietary control system
    • Up to 8 gas lines and 2 liquid sources
    • Independent hardware safety interlocks
    • Integration of vacuum pump systems in cooperation with leading pump manufacturers

Categories

206 PV Equipment
  • Cells
    • 207 Equipment, Process
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; ALD/REALD; LPCVD; MVD
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
    • 401 Sub-systems
  • Computer; Control; Communication; Data Acquisition Systems
  • Gas; Liquid delivery panels as subsystems
    • 500 Factory Monitoring & Control Systems (FMCS)
  • Gas Handling - Cabinets; Control; Supply Systems
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