The new 2022 HEXAGON delivers thin film production in FanOut and Wafer Level Packaging
Combining fully automated handling with dgeas, etch amd PVD technologies, Evatec's dedictased packaging solution simply gives you more when it comes to thin fim processes for wafer level chip scale packaging (WLCSP) on 200 and 300mm
Choose HEXAGON for class leading Rc and the lowest cost of ownership:
- Best degas efficiency
- Highest seed layer reliability
- Best proces repeatability
- Best throughputs
To learn more about the new HEXAGON simply visit the Evatec booth.