Evatec AG

  • Booth: N501

Welcome to the "Thin Film Powerhouse".

Evatec delivers complete thin film production solutions for Advanced Packaging, MEMS, Power Devices, Wireless Technologies, Optoelectronics & Photonics. We offer a range of batch, cluster and inline platform architectures for deposition of metals, TCOs, and dielectrics according to your production throughput and fab integration needs. Evatec Advanced Process Control (APC) technologies maximise throughput and process yield.

From the sputter deposition of next generation AlScN piezoelectric materials enabling 5G on CLUSTERLINE® to new clustered high throughput metallization solutions on 6 and 8 inch in our Multi BAK  ( BAK 941) Evaporators, visit our booth to find out how our production tools can help you solve your production challenges in MEMS and Wireless Communication.

Visit the booth to learn about our new generation 2022  HEXAGON tool , designed for Wafer Level Packaging applications to give the lowest Rc values and the best cost of ownesrhip in the industry . Within Optoelectronics drive down your costs for deposition of ITO, mirrors and contacts in production of LED, VCSEL and Micro Display using the latest developments on our CLUSTERLINE®  200 BPM that enhance uniformity, drive down particles and enhance throughput.  You read more about industry trends and process capabilities across all Evatec core markets in our technology magazine "LAYERS". Please come to the booth to get your own printed copy.

The Evatec team look forward to welcoming you to booth N501.


    Evatec's new 2022 HEXAGON takes all the proven performance of the first generation tool and simply gives you more - more process capability. more flexibility, more uptime and more throughput . Why not find out more at the Evatec booth ?...

  • The new 2022 HEXAGON delivers thin film production in FanOut and Wafer Level Packaging

    Combining fully automated handling with dgeas, etch amd PVD technologies, Evatec's dedictased packaging solution  simply gives you more when it comes to thin fim processes for wafer level chip scale packaging (WLCSP) on 200 and 300mm

    Choose HEXAGON for class leading Rc and the lowest cost of ownership: 

    - Best degas efficiency 

    - Highest seed layer reliability 

    - Best proces repeatability

    - Best throughputs

    To learn more about the new HEXAGON simply visit the Evatec booth. 

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