System Technology (Shenzhen) Co. ,Ltd

Shenzen, 
China
http://www.grind-system.com
  • Booth: A612


Welcome to System Technology (Shenzen) Co Ltd.

Advocating for advancement in grinding systems technology. 

From a humble beginning in 2015, System Technology have established ourself as one of the leading manufacturer for superabrasive diamond/cbn cutting/sawing and grinding product in China. We continously innovate product and application solutions to assist customer in sawing/grinding issues in a very versatile manner. 

We provide the following product solutions for your dicing/sawing needs.

a. Precision Electroplating Hub blades for wafer sawing

b. Precision Hubless blades for package sawing - in electroplating, metal and resin bond

c. Dressing board 

d. Microporous ceramic chuck. 

Do visit us at our website www.grind-system.com

Below link into our company introduction - https://mp.weixin.qq.com/s/KOhMqzcSbPlmHVIqcTMEdA

 Products

  • Precision Electroplating Hub Blade
    Hub Blade are made of ultrafine diamond particles and high precision aluminum alloy substrate through a fine electrodeposition process. This results in a high precision, narrow cutting kerf and with minimal chipping...

    • Comparisons of chipping performance 

  • Precision Electroplating Hubless Blade
    Electroplated soft blade without steel core is prepared by using electroplating to anchor the free diamond particles. This type of blades is very sharp, has a long service life and can be used for a wide variety of applications.
    ...

    • Product Performance - 

  • Precision Metal Hubless Blade
    Metal soft blade without steel core is made by mixing and sintering metal powder and diamond particles through powder metallurgy technology, reaching a high hardness with excellent toughness and long service life....

    • Product Performance

  • Precision Resin Hubless Blade
    Resin soft blade without steel core is prepared by curing the thermosetting resin which has been mixed with diamond particles. This type of blades is very sharp, with a long service life and little chipping

    ...

    • Product Performance

Categories

200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Ball Placement; Attach Systems
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Wafer Mount; Taping Equipment
    • 205 Equipment, Nanotechnology
  • Equipment, Nanotechnology
    • 300 Materials, Assembly
  • Scribe Tools; Saw or Dicing Blades and Accessories
    • 701 Manufacturing Services or Consulting
  • Wafer Handling
    • 900 Support Products
  • Tools
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