CORTEX ROBOTICS SDN BHD

Bayan Lepas,  Penang 
Malaysia
http://www.cortexrobotics.my
  • Booth: N1212


Welcome to CORTEX ROBOTICS! We look forward to see you!

CORTEX ROBOTICS SDN BHD is an innovative Automation Equipment & Advance Inspection Solutions provider. Established in Penang, Malaysia, we conduct design, research and development on automation solutions for process improvements across various sectors.

Our experiences and rapid business growth had positioned us as a reliable solutions provider in the industry, leaving footprints across Asia pacific. We have presence in many countries including Singapore, Thailand, Vietnam, Indonesia, Philippines, China, Japan and Taiwan. We take pride in building relationship with our customers who are also our valued partners, understand them, accepted feedbacks while overcoming the limitation together. We are committed to provide the highest level of services and support to help our customers simplified and fastens their industrial processes. 

This year, we will be showcasing our full range of AOI equipment and solutions supporting the Semiconductor Backend Manufacturing Process such as Wafer AOI & High-Speed Wirebond AOI.A proven success technology serving the Market Leader in Semiconductor Industry.

Please visit us at N1212, Malaysia Pavilion.

We look forward to serve you there!

Stay Safe & Take care!

Cortex Robotics, Your reliable AOI Solutions Partner.

www.cortexrobotics.my

 Products

  • 1. High Performance Wafer AOI Solution
    A high-performance Wafer AOI solution with SWIR feature that automatically detect major, minor, inner layers and side wall defects of wafer while providing reliable and precise results ....

    • High Performance Wafer AOI Solution

    Alpha is a series of high-performance Wafer AOI solution that automatically detect major or minor wafer defects while providing reliable and precise results. It’s supported various types of wafer in semiconductor, electronics, automotive, medical and Optoelectronic industry.

    Highly rated by top semiconductor supplier in the world.

    Features:

    • NEW SWIR-Inner layer Inspection
    • Colour & Mono Camera
    • Fitted Wafer Size : 6inch, 8inch, 12inch
    • Fitted Wafer Type: Bare Wafer, Film Frame Carrier
    • Dual Fork Robot for qucik wafer transition
    • Auto Teching recipe setting
    • Quality Analysis System
    • Auto-alignment for bare wafer (orientation check)
    • Auto Focus (Motorized objectives lens)
    • Able to perform offline verification without disturbing the on-going process
    • Stable machine structure with granite table to prevent vibration
    • Optional Features: Marking, Bottom Inspection

    Defects:

    • Chipping, cracks, stains, blistering, scratches, lifted metal, meandering, damaged bump, un-seperation, off-set cut, foreign material. missing solder ball,  dent on solder ball and etc

    Check out our Brochure : Here

  • 2. High Precision Wirebond AOI Solution
    A High Precision Wirebond AOI solution equip with the latest & high specification technologies which able to perform a smarter and high accuracy inspection on die and on a very fine wirebond....

    • High Precision Wirebond AOI Solution

    Vega is a High Precision Wirebond AOI solution equip with the latest & high specification technologies which able to perform a smarter and high accuracy inspection on die and on a very fine wirebond. Its also able to perform inspection on various types of substrate, leadframe and pallet.

    Widely used by top semiconductor manufacturers in the world.

    Features:

    • Support Substrate, Leadframe, Pallet
    • Multiple Magazine Conveyor
    • Magazine Count / Lot Checking
    • Magazine Orientation Sensing
    • 1D/2D/RFID Magazine Reader
    • Quality Analysis System
    • E-Map
    • High Resolution Camera & Auto Focusing
    • 8 to 1 Centralised Verification System
    • SECSGEM Compatible
    • Auto Frame Width Adjustment
    • Able to perform offline verification before reject
    • Optional Features: Reject Modules (Inking, sorting, laser marking), Bottom Inspection, Long-term Storage, Offline Teaching

    Defects:

    • wire drop, wire broken, wire sagging, wire sweeping, torn bond, wire missing, double-bond, lifted wire, lifted ball, ball dimension, particle on die, die offset, epoxy underfill/overflow, lead bent, lifted stitch, die coating

    Check out our brochure: here

  • 3. Strip to Strip Leadframe & Package AOI Solution
    Mira is a High-Speed Strip to Strip AOI solution with multiple inspection capabilities and low energy consumption solutions....

    • Strip to Strip AOI Solutions

    Mira is a High-Speed Strip to Strip AOI solution with multiple inspection capabilities and low energy consumption solutions.Its also able to do inspection on die attached and various types of leadframe and package.

    Features:

    • Dual Scan Capabilities (Top & Bottom Inspection)
    • 1D & 2D Reading
    • Fine Detection
    • Line Scan Camera
    • Defect mapping with images
    • Optional Features: Laser Marking System, Offline Verification, NAS Storage Solution

    Defects:

    • Package rough surface, crown flash, chipped, overfill, underfill, scratches, positioning, crack and etc
    • Leadframe foreign material, damage, missing, bridge, broken, scratch, bent and etc

    Check out our Brochure: here

  • 4. Turret IC Package AOI Solution
    Meteor is a 10 Sided High-Speed On-The-Fly Automatic Optical Inspection machine....

    • Turret AOI

    Meteor is a 10 Sided High-Speed On-The-Fly Automatic Optical Inspection machine. This machine adopted some new approaches & methods in inspection to cover all the inspection surfaces and widest defect list while providing the highest output yield. IC inspection before packaging process.Supporting many types of industries products including semiconductor and Optoelectronics Industry.

    Features:

    • 10 sided inspection coverage
    • Wide Product Size Support (Min: 7.24mm x 6.48mm / Max: 19.56mm x 32.33mm)
    • Flexible Input & Output (Tube to Tray / Tray to Tray / Tray to Tube / Tube to Tube)
    • Input: Plastic Tube, Metal Tube, JEDEC Tube
    • Reject Station: Defects products can sort into tube or tray
    • Motorized Camera
    • Generate Report & Save Image
    • Reject Object Mapping
    • SECSGEM
    • IC Chips and many range of singular products
    • Optional Features: Marking, Offline Teaching, Long Term Storage

    Defects:

    • lead pitch, lead width, lead offset, lead length measurement, lead span, scratches, foreign material, chipping, incomplete fill, overfill, OCR checking and etc

    Check out our brochure: here

  • 5. High Speed Tape & Reel AOI Solution
    Electra is a powerful High-Speed Tape and Reel AOI Solution that is capable to inspect fine defects....

    • High Speed Tape & Reel AOI Solution

    Electra is a powerful High-Speed Tape and Reel AOI Solution that is capable to inspect fine defects. Its support various pocket width of tape and reel.

    Features:

    • Dual Track Operation
    • Autosave failed defect images
    • Fine Detection
    • Line Scan Camera
    • Defect Mapping with images
    • Optional Features: Laser Marking System, Offline Programming, 2D Code Reading
    • NAS Storage Solution

    Defects:

    • Scratches, Chipping, OCR/Marking, Orientation, Foreign Material, Lead Bend

    Check out our Brochure: here

  • 6. Glass Top AOI Solution
    Diya is a 6 Sided High Speed On-The-Fly Automatic Optical Inspection machine....

    • Glass Top AOI Solution

    Diya is a 6 Sided High Speed On-The-Fly Automatic Optical Inspection machine. The vision system has a familiar GUI, features realtime display of image acquisition & defects inspected. It allow user to quickly setup & inspect customer’s product from the vibrator bowl. This machine adopted some new approach/methods in inspection, so to cover the widest defect list while providing highest output yield.

    Features:

    • Support: Optoelectronics products, semiconductor products, Singular pieces Products
    • Surface Coverage: 6 sides, top, bottom, left, front, rear inspection
    • Fully configurable lighting
    • Dual image with different different illumination setup for broader defect detection
    • System reject unit is recycled back to the vibrator bowl
    • Auto Fail Image Saving
    • Inspection Results Logging
    • Multi-user Password Control
    • Optional Features: 1D Barcode Reader, Ionizing Fan, Offline Setup Station

    Defects:

    Top Surface

    • Chipped Package, No Marking, Marking Alignment, Incomplete Mark, Double Mark, Contamination Bubble, No Resin, Excess Resin (Overfill), Mix Device, Mixed Color, Limited Die & Wirebond Detection

    Bottom Surface

    • Lead Related Defects, Package Chipping, Damage, Resin Overflows, Contamination

    Side Surface

    • Lead Relared Defects, Package Chipping, Damage Contamination

    Check out our Brochure: here

Categories

202 Equipment, General Use
  • Vision; ID; Bar Code Systems
    • 203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Line Width; Critical Dimension (CD) Measurement
  • Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes
  • Package Inspection; Lead Scanners
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
    • 701 Manufacturing Services or Consulting
  • Automation & Robotics
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