| INSPECTION |
| Inspection Capabilities | - Detecting wafer cosmetic defect, measurement, ink dot for wafer, probe mark & etc |
| Recipe / Setup (On and O -Line) | - Automatic “golden die” image generation from production wafer. Interactive graphical tools for various zone de nition. User-de ned detection parameters per defects and zones. |
| Resolution | - Changeable with multiple lens, up to 0.35μm per pixel |
| Accuracy | - up to 0.7μm |
| - Represents deviation between average of the distribution of results of repeated measurements of golden target and it certi ed value. |
| Repeatability | - up to 0.7μm at 3 sigma |
| - Represents 3 sigma deviation value of the distribution of results of repeated measurements of the same real component. |
| Minimum Defect Detection | - up to 1μm |
| SYSTEM CONFIGURATION |
| Factory Automation | - Secs/Gem |
| Cleanliness | - Class 100/1000 |
| Particles removal system | - Hepa System |
| WAFER HANDLING |
| Wafer ID | - Reading capability : SEMI M12, M13, M1.15, T1.95 |
| - OCR |
| - ECC200, T7 DtaMatrix, QR-Code |
| - BC412, IBM412 |
| Wafer Type | - Wafer & Film Frame Wafer |
| Supported Wafer Size | - 6", 8" & 12" |
| Wafer Cassettes | - Standard Cassettes: Entegris, Empak or Fluoroware (FOUP Optional) |
| Wafer Handling | - Twin Arms Wafer Robot with Slot Sensor (Mapping) |
| OUTPUT |
| Output Data | - Wafer Map, SPC Analysis Report, KLARF |