Nidec-Read Corp.

Kyoto-shi Ukyo-ku,  Kyoto 
  • Booth: A518

High-speed ! High-accuracy! E-Test and AOI solution provider

Nidec-Ready History
Nidec-Read’s main business is the development, manufacturing and sale of inspection equipment for semiconductor package substrates and printed circuit boards, as well as inspection fixture. In recent years, it has expanded its product portfolio into small capacitance measurement equipment for touch screen panels and optical inspection equipment for semiconductor wafers.

Where we are heading to
Embedded electronic active/passive components in smartphones and IoT devices are required to be increasingly small and power efficient. Also, new semiconductor packaging technologies that created embedded electronic component substrates and Fan Out Wafers Level Packages (FOWLP)¹ are diversifying and tightening inspection requirements.We have
 sought for a new inspection method that responds to the foregoing development in semiconductor packaging and that ensures its mid- to long- term growth target hy completing acquisition of SV Probe Pte.Ltd(probe card manufacturer).

Product Outline
*E-testing inspection system
*AOI inspection system(2D/3D/SD)
*Fixture(Probe,MEMS Probe)
*Probe Card

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