With the growth of ENIG and ENEPIG for wire bonding or soldering of semiconductor dies, the need for production-proven plating equipment has become critically important. While there are many good options on the market for purchasing semiconductor ECD tools for high-volume manufacturing, electroless and immersion plating require a much different type of tool. The unique and specialized aspects of designing a plating cell for successful and consistent electroless and immersion plating are well known by the engineering staff at Technic’s Surface Finishing Technologies Group. The Semcon 2500 plating tool is the culmination of years of experience designing such tools and is fully compatible with any commercially available electroless, immersion, and ancillary chemistries as well as Technic’s exclusive line of Elevate brand chemistry for ENIG and ENEPIG.
The Semcon 2500 is a tri-axis, fully automatic, cleanroom-rated plating tool for deposition of electroless nickel, electroless palladium, immersion gold, immersion palladium, and immersion silver chemistries. The system processes wafers from 50 – 200 mm using custom or commercially available wafer cassettes. The Semcon® 2500 offers ease of operation with multiple programming options, easy changeovers, with convenient maintenance access all in a space-saving and highly reliable tool.