SMART Modular Technologies Sdn Bhd

Perai,  Penang 
Malaysia
https://www.smartm.com/

• Booth: N1315

Think Memory. Think SMART.

SMART Modular Technologies is a global leader in specialty products including memory modules, solid state storage products and hybrid solutions which are critical to electronic devices and are available in standard, custom and ruggedized, high performance, high capacity applications.

SMART is a pioneer of secured, ruggedized solid state drives (SSDs) incorporating additional attributes such as encryption, secure data elimination and write-protect features required in the high-performance military, aerospace and industrial markets.

Taking innovations from the design stage through manufacturing and supply, SMART Modular has developed a comprehensive product line comprised of DRAM, Flash and hybrid memory and storage technologies across various form factors. SMART Modular is a subsidiary of SMART Global Holdings, Inc.

 Press Releases

• SMART Modular Announces the SMART Kestral PCIe Optane Memory Add-in-Card to Enable Memory Expansion and Acceleration (May 05, 2022)

  NEWARK, Calif., April 12, 2022 — SMART Modular Technologies, Inc. (“SMART”), a division of SGH (Nasdaq: SGH) and a global leader in memory solutions, solid-state drives, and hybrid storage products announces its new SMART Kestral™ PCIe Optane™ Memory Add-in-Card (AIC) which is able to add up to 2TB of Optane Memory expansion on a PCIe-Gen4-x16 or PCIe-Gen3-x16 interface independent of the motherboard CPU. SMART’s Kestral AICs accelerate selected algorithms by offloading software-defined storage functions from the host CPU to the Intel FPGA on the AIC.

  SMART’s Kestral memory AICs are ideal for hyperscale, data center, and other similar environments that run large memory applications and would benefit from memory acceleration or system acceleration through computational storage.

  “With the advancement of new interconnect standards such as CXL and OpenCAPI, SMART’s new family of SMART Kestral AICs addresses the industry’s need for a variety of new memory module form factors and interfaces for memory expansion and acceleration,” stated Mike Rubino, SMART Modular’s vice president of engineering. “SMART is able to leverage our many years of experience in developing and productizing controller-based memory solutions to meet today’s emerging and continually evolving memory add-on needs of server and storage system customers.”

  
  Key benefits:

  • More memory per server at lower cost per gigabyte
  • Field upgrades for new algorithms and protocols
  • Seamless upgrades for existing servers with custom memory solutions
  • Support for multiple memory technologies and protocols, including Intel Optane DIMMs, DDR4 RDIMMs, and LRDIMMs

  
  Technical specifications:

  • Full-Height, Half-Length (FHHL), dual slot form factor
  • Less than 150W Thermal Design Power (TDP) using a passive heatsink
  • Intel Stratix® 10 DX FPGA enabled with multiple IP support for defining custom solutions
  • Quad Core ARM A53 with dedicated on-board 2GB DDR4 memory and 8GB storage acceleration
  • Four DIMM slots with two independent channels, which can be populated with four Optane DIMMs up to 512GB each or two DDR4 RDIMMs up to 256GB each
     

  Future AICs from SMART will be capable of supporting 4TB of Optane Memory in persistent App Direct Mode via normal load/store semantics for all CPU architectures -- freeing up precious, direct-attached DDR DIMM slots. SMART Kestral memory cards are ideal for Artificial Intelligence (AI) and Machine Learning (ML) training servers, permitting large algorithms to be developed quickly and without risk of failure during a power loss event.

  For more information on SMART Kestral Memory AIC, visit the product page and technical brief or contact sales team at info@smartm.com.

• SMART Modular Technologies Announces Next Generation of ME2 Flash (May 05, 2022)

  NEWARK, Calif., March 30, 2022 — SMART Modular Technologies, Inc. (“SMART”), a division of SGH (Nasdaq: SGH) and a global leader in memory solutions, solid-state drive (SSD) and hybrid storage products announces the next generation of its DuraFlash™ ME2 family of SATA SSD products, which includes industry-standard M.2 2242, M.2 2280, mSATA, Slim SATA and 2.5” form factors. These SSDs are available in both industrial and commercial temperature grades and have versions that implement SMART’s SafeDATA™ power-loss, data-protection technology for graceful handling of power fluctuations and sudden power loss events.

  The new ME2 SSDs incorporate the latest generation 3D NAND-technology and SMART Modular’s proprietary NVMSentry™ firmware to deliver high performance SSD products with endurance up to one drive writes per day (DWPD) for five years using JEDEC JESD219A enterprise endurance workload. The new NAND device offers better cost per bit over previous 64-layer and 96-layer NAND generations without sacrificing performance and reliability.

  Further optimization of the NVMSentry firmware also yields enhancements in read and write consistency over wide ranges of application workloads. High performance computing, data centers, networking, cloud systems and many other applications that demand high reliability and consistency over long operating lifetime can benefit from the new ME2 SSD products.

  Victor Tsai, director of Flash products at SMART Modular, explains, “We are constantly looking to leverage improvements in NAND technologies to offer state-of-the-art memory solutions for our customers. We work in partnership with them to deliver denser, faster, cost-optimized storage solutions to meet their ever-evolving needs in performance and endurance requirements. Our NVMSentry firmware and SafeDATA technology provide the best in class performance consistency and protection of data when power supplies to the system are unreliable and suffer from brown outs and outages.”

  ME2 SSD products are available in the following standard form factors, capacities, temperature grades, and available with the SafeDATA feature. SMART can also custom-build SSDs to address specific needs.

  Form Factor	Capacities	Temperature Grade	SafeDATA Technology Version
  M.2 2242	240GB – 960GB	Industrial and Commercial	No
  M.2 2280	240GB – 1920GB	Industrial and Commercial	Yes
  MO-297 slim SATA	240GB – 1920GB	Industrial and Commercial	No
  mSATA (MO-300)	240GB – 1920GB	Industrial and Commercial	No
  2.5”	240GB – 1920GB	Industrial and Commercial	Yes

  For more information on SMART’s new ME2 SSDs, visit the product page at ME2 SATA SSDs.

• SMART Modular Technologies Announces New DuraMemory DDR5 VLP RDIMM (May 05, 2022)

  NEWARK, Calif., February 16, 2022 — SMART Modular Technologies, Inc. (“SMART”), a division of SGH (Nasdaq: SGH) and a global leader in memory solutions, solid-state drives, and hybrid storage products announces its new DDR5 32GB Very Low Profile Registered Dual In-Line Memory Module (VLP  RDIMM). SMART’s new DuraMemory™ DDR5 32GB VLP RDIMM is the industry’s first DDR5 VLP RDIMM form factor. 

  The 32GB VLP RDIMM addresses applications with space constraints, such as embedded 1U blade compute and storage, enterprise networking, telecom, and industrial single-board computers (SBCs). The space savings also equates to improved heat dissipation and energy savings, reducing business costs. 

  

  The DDR5 32GB VLP RDIMM is the newest addition to SMART’s broad portfolio of VLP and ULP (Ultra Low Profile) modules that are suitable for all types of dense computing, storage, networking and telecom applications. For ruggedized and harsh operating conditions, SMART also offers retention clips to secure the socket latches in place, and industrial grade temperature operation of -40°C to +85°C.

  Arthur Sainio, director of product marketing for DRAM at SMART, explains, “SMART has a long history of providing VLP and ULP modules for a wide variety of blade applications. Currently we’re seeing growing industry interest and demand for VLP modules for the new DDR5 1U blade in computing and storage applications.”

  Features of the DDR5 VLP RDIMM:

  • DDR5 technology provides improved channel architecture, uses lower IO voltage and power, and offers other advantages over DDR4
  • VLP RDIMM height (18.75mm) allows for vertical DIMM placement in 1U blades and saves board space
  • High density achieves up to 384GB in 1U compute and storage-blade systems with 12 DIMM sockets
  • High performance DDR5-4800 enables 4800 MT/s  

  SMART plans to begin sampling of the DDR5 32GB VLP RDIMM in Q1 2022. For additional product information and specifications, visit the VLP RDIMM product page.

• SMART Modular Expands ME2 SATA SSD Product Family (May 05, 2022)

  NEWARK, Calif., March 24, 2021 — SMART Modular Technologies, a subsidiary of SMART Global Holdings, Inc., (Nasdaq: SGH), has expanded its DuraFlash™ ME2 SATA SSD product family with the addition of M.2 2242 SATA, mSATA (MO-300A) and Slim SATA (MO-297A) that complement the current M.2 2280 and 2.5” SSD form factors in SMART’s DuraFlash portfolio.

  The new ME2 SATA SSD form factors are ideal for embedded computing, transportation, medical and industrial applications that require either smaller or legacy SSD form factors. Built with Triple-Level Cell (TLC) 3D NAND technology, they are available in both commercial (0 °C to 70 °C) and industrial (-40 °C to 85 °C) operating temperatures. The ME2 family SSDs provide enhanced reliability by incorporating advanced LDPC (Low Density Parity Check) error detection and correction, plus end-to-end data path protection ensuring extremely high data integrity and reliability.

  All three SSDs feature SMART Modular’s proprietary NVMSentry™ firmware that combines features for both customization and/or optimized product performance. For example, the firmware algorithm is adjustable in order to tailor performance to meet specific application needs, plus there are add-on proprietary features available to customers, including enhanced secure erase and customized functions.

  For a complete list of the NVMSentry advantages, visit the SMART Modular website.

  SMART Modular’s Flash Product Director, Victor Tsai, explains the reason behind this product expansion:  “By expanding the ME2 product line we’re able to give our customers a full portfolio of SATA products with these enhanced features. Plus, it provides a broader choice of products for our customers across a wider, more sophisticated degree of market applications.”

  All three of these new products are offered in a variety of capacities. The M.2 2242 is available in capacities from 240GB to 960GB and up to 560MB/s Read and to 500MB/s Write. The mSATA and Slim SATA are available in capacities from 240GB to 1920GB and up to 560MB/s Read and 520MB/s Write.

  For more information on this new family of ME2 SATA SSDs, contact SMART Modular’s Sales Team or send a request to info@smartm.com.

• SMART Modular to Showcase its DDR4 Differential DIMM at the Flash Memory Summit (May 05, 2022)

  NEWARK, CA, August 5, 2019 — SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., (NASDAQ: SGH), and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products, today announced that it will be showcasing its Open Memory Interface (OMI) DDR4 Differential DIMM (DDIMM) at this week's 2019 Flash Memory Summit in Santa Clara, CA.

  SMART Modular joined a growing roster of technology organizations in August of 2018 that are contributing to the OpenCAPI™ Consortium, working collaboratively to drive data center server innovation. Through the Consortium, members are working to innovate on top of OpenCAPI, a high performance coherent bus standard designed to help the technology industry better meet the growing demands for more advanced memory, accelerators, networking and storage technology. Using the OMI specification, developers can enable high performance accelerators like FPGAs, GPUs, and network and storage accelerators to perform functions that a server's general purpose CPU is not optimized to execute.

  SMART's OMI DDR4 DDIMM is a leading-edge, transformative memory module that enables a data throughput rate of 25.6GB/s with a latency of 40ns and densities up to 256GB. The new 84-pin DDR4 DDIMM is intended for use in standard server environments, utilizing a serial interface and a differential Data Buffer (dDB) from Microchip®. The DDIMM supports IBM's P9 AIO and P10 processors' memory attached architecture. The P9 AIO and P10 memory bus is defined with one read port and one write port per channel, each having eight unidirectional differential lanes supporting 25.6 Gbps data rate over the OMI direct attached to the DDIMM.

  "Microchip's SMC 1000 8x25G is the industry's first Open Memory Interface (OMI)-to-DDR4 DRAM serial memory controller and a key building block for the SMART Modular OMI DDIMM," said Andrew Dieckmann, vice president of marketing and applications of the Data Center Solutions business unit at Microchip's Microsemi subsidiary. "CPU- and compute-centric SoC devices can achieve four times the memory bandwidth per pin, memory media type independence, and lower system memory costs by adopting technologies such as OMI-based DDIMMs over traditional parallel DDR DIMMs."

  The development model of the OpenCAPI Consortium is one that elicits collaboration and represents a new way in exploiting and innovating around coherent accelerator processor technology. SMART has made significant contributions to the development and production of the DDR4 DDIMM to further advance differentiation and growth of the OpenCAPI ecosystem.

  The 2019 Flash Memory Summit will be held August 6-8 at the Santa Clara Convention Center and expects to draw more than 6,500 attendees and 120 exhibitors.

  To learn more about SMART's OMI DDR4 DDIMM, visit SMART at booth #627 at the Flash Memory Summit or visit www.smartm.com/DDIMM. 

 Products