Component Technology Pte Ltd

Singapore,  Singapore 
  • Booth: A615

Innovation Made Real @ Component Technology

We are a developer and distributor of Automated Optical Inspection (AOI) solutions to the semiconductor assemblies and packaging industry. With over 30 years of rapport with the key semiconductor players, we are now one of the leading AOI solutions provider operating from multiple facilities across Asia. As a trusted provider of automated and cost-effective vision inspection solutions, our customers span across Southeast Asia, Europe, South America, and East Asia.

Our key products include automated vision inspection machines for Wafer, Lead Frame, Die & Wire Bond, and X-ray Image Analyser. We can customize the equipment and inspection software features to your applications.   

For more info, please visit


  • IV-E1700
    Post Die & Wire Bond Inspection Machine
    1600 (W) x 1200 (D) x 2000 (H) mm

    A proven and effective 3D inspection system implemented in many IDM and OSAT factories.

  • Key Features

    ● Lead frame handling size from:
       110 - 300 (L) x 15 - 100 (W) x 0.1 - 1.5mm (THK)
    ● Reject option with choices of inker, lead punch or laser cut
    ● Inspection of data for SPC quality control purpose
    ● Patented 3D Stereo Vision Triangulation, control software and lighting
    ● User-friendly and flexible recipe teaching

  • IV-T3300
    Automated Die & Wire Bond Inspection Machine
    1200 (W) x 1200 (D) x 1820 (H) mm

    Automated 2D or 3D vision inspection system for wire bonding and other surface defects....

  • Key Features

    ● Flexibility to dock with different material handling systems:
           ♦ JEDEC tray             ♦ Carrier boat
           ♦ Waffle pack            ♦ Lead frame
           ♦ Nikko rack              ♦ PCB assembly
    ● Available in single or dual-track loading option
    ● Quick trays change of 5 to 7 seconds
    ● Large inspection area of 600mm x 550mm 
    ● SECS / GEM and FTP communication ready
    ● Touch screen monitor for easy operation
    ● Vacuum / CDA blower for foreign particles removal
  • IV-W2000
    Automated Wafer Inspection Machine
    1400 (W) x 1150 (D) x 1540 (H) mm

    A very competitively priced wafer inspection system for pre and post sawing in semicon backend operation.

  • Key Features

    ● Handle 6/8/12 inch MEMS and CMOS wafers 
    ● English, Chinese, Japanese language UI options
    ● On-the-fly scanning and inspection
    ● Yield loss control and calculation
    ● Support multiple types of E-Map
    ● Teaching wizard for motion setup
    ● Dual touch screen with multi-touch capabilities
    ● SECS / GEM and FTP communication ready
    ● Offline assist and review software
    ● Ergonomic, compact and space-saving

For Technical Support with this webpage, please contact support.