Gaotec Sdn Bhd

  • Booth: N508

GAOTEC SDN BHD an authorized solutions provider.

GAOTEC SDN BHD is an establish organization representing mutinational manufacturers of equipments, machinery & tools for many industries such as Semiconductor, Automotive, Electronics, Lighting, Phamaceutical, Aerospace, Energy, Plastics, Engineering etc.

OGP Smartscope-OGP® pioneered multisensor measurement with vision, touch probe and laser sensors. OGP has been a leader in advanced metrology and quality control for over 75 years and OGP has introduced products that have made a significant impact in precision and reliability in the manufacturing industry.

TRY PRECISION-TRY PRECISION is a professional supplier of industrial bond testers, utilizing precision sensing technology. Our MFM Series Multi-function Bond Tester is a professional, dynamic shear force ( or “push-pull”) testing instrument used for the failure analysis so crucial in microelectronic, microelectronic packaging, PCAB and and other electronics manufacturing. 

CLC CONTROL LASER-Precision industrial strength laser engraving, cutting, drilling and welding systems. With laser for every type of applications - CO₂ , Fiber, IR, Green, UV, and DUV

SAIREM-Wide range of  reactors and systems for plasma generations, offering energy stability, short response time and high spectral quality for applications in plasma research, diamond  deposition (DL), surface cleaning, nanomaterials, abetment.

BOFA-Fume Extractor & Filtration Technology.

HEIDENHAIN-HEIDENHAIN develops and manufactures linear encoders, angle encoders, rotary encoders, digital readouts, and CNC controls for demanding positioning tasks.

CCS-LED lighting manufacturer and vision solutions partner to many system integrators and machine makers globally. Our products can be found in many industries such as semiconductor, manufacturing, logistics, automotive, electronics and pharmaceutical. 

KULICKE & SOFFA (K&S)-Dicing Blades-supported by our vast network of global resources and industry-leading expertise in all phases of back-end semiconductor packaging and assembly, the K&S dicing blade team is structured to help you, in every way, from improving yields to increasing your productivity, and ultimately attaining higher profitability.

If you are interested to represent Try Precision, CLC Laser & Sairem, do welcome to contact us @ +604-6440428 


  • OGP Smartscope
    OGP® SmartScope 3D multisensor measurement systems combine optical, laser and tactile sensors, letting you measure parts more completely, with lower uncertainty and in less time.


  • SmartScope® ZIP® systems offer superior optical performance and a range of machine travels to deliver reliable performance. SmartScope ZIP models feature the proven performance of AccuCentric® autocompensating 7:1 zoom optics. Multiple illumination sources – including monochromatic substage LED profile, white LED TTL surface, SmartRing™ white LED ring light, and optional VuLight™ oblique illuminator – are available to illuminate your toughest measurement challenges.

    SmartScope ZIP systems are available in a range of XYZ measurement volumes, from 250 x 150 x 200 mm to 800 x 820 x 300 mm.

    All ZIP models excel at video measurement and multisensor versatility for the highest productivity. Standard ZIP models are configured for the toughest applications.

    SmartScope® ZIP® 250 sets a high standard in benchtop metrology. This durable system features fast stage speed for maximum throughput and short cycle times, without sacrificing accuracy. A heavy duty cast base with Y-axis center drive assures metrological stability. ZIP 250 also offers:

    Accurate video metrology – AccuCentric® motorized zoom lens automatically compensates magnification for each zoom position

    Reliable & Precise –Heavy-duty cast base and integral compound stage with Y-axis center drive for stability

    Multisensor versatility – Optional touch probes, lasers and micro-probes

    XYZ Travel (mm)
    250 x 150 x 200

    MFM Series multi-function bond tester is a professional, dynamic shear force ( or “push-pull”) testing instrument used for the failure analysis so crucial in microelectronic, microelectronic packaging, PCAB and and other electronics manufacturing....

  • MFM Bond Tester

    ● Accuracy ±0.25%FS :MFM1200L
    ● Accuracy ±0.1%FS :MFM1500HF
    ●Function: Wire Pull / Ball Shear / Die Shear / Tweezer Pull / Bump Pin Pull / Cold
    Ball Pull / Cold Bump Pull / Hot Ball Pull etc.
    ●Application: Semiconductor / SMT / Material analysis etc.

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