ACCRETECH (MALAYSIA) SDN. BHD.
ACCRETE + TECHNOLOGY = Welcome to ACCRETECH!
As one of the leading machine makers in Semiconductor Production Equipment, Tokyo Seimitsu Co., Ltd. (Accretech) is no stranger in the market providing high quality and cutting-edge technology solutions to the semiconductor market.
Led by our remarkable model of AD3000T PLUS, our dicing saw machine line-up has proven best in quality & technology in production. As for grinding process, our PG3000RMX offers comprehensive solution with various applications in one system, and our hot hatch HRG grinder excels in high throughput & accuracy, both focusing in sophisticated wafer thinning and damage-less removal.
The newly launched AP3000 & AP3000e as a successor model in wafer probing has proven to be the best choice in front end wafer fabrication process.
Visit us at booth A204 for more details!