Onto Innovation South East Asia

Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity. This new technology is the foundation of Onto Innovation’s products designed to offer fast throughput, increased brightfield and darkfield sensitivity and solves site challenges related to large package inspection.

The Dragonfly G3 system offers Clearfind® Technology for non-visual residue detection. For specialty markets, such as CMOS image sensors (CIS), the Dragonfly System uses a combination of oblique angle illumination with sophisticated image processing and a machine-learning algorithm to detect low contrast defects in the active pixel sensor area.

The Dragonfly G3 system is tightly integrated with control and analytical software for real-time analysis and review, IR defect inspection and review, while also providing offline review options. When massive amounts of bump data are generated during inspection, users now have the tools to visualize data, correlate process variations and improve yields through exploratory data analysis down to the bump level.

• Inline real-time focusing
• Flexible platform to allow for metrology sensor integration
• IR defect inspection and review
• Large die and package support (>6400mm2)
• Substrate support: 100mm - 330mm wafers
• Substrate handling: wafer, frame, warped, thin, waffle pack, porous
• High warped wafer and Taiko handling options

The Atlas XP+ system offers a single platform for both thin film and OCD measurements for 200mm wafer metrology. The system incorporates a dual-arm robot, high-precision stage and high-speed focus system. The system also features advanced pattern recognition, improved thickness reproducibility and superior SR and SE throughput. The N2000™ software interface and advanced automation are compliant with standards adopted by SEMI and other organizations. The NanoNet® feature, a network component of the N2000 Analysis Platform software provides system-to-system matching and seamless recipe transferability.

The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices. The innovative optics design extends the dynamic range for film thickness measurement from 50Å to 35µm on a single platform and offers extendibility to measure high aspect ratio advanced 3D NAND structures. Expert Applications System (EASy™) software provides flexibility for development of user-defined algorithms for modeling complex multi-layer stacks. The Echo system also expands the materials characterization capability of the PULSE technology systems. In addition to Young’s Modulus of low-k dielectric films in BEOL and amorphous carbon hard masks in 3D NAND, the Echo system includes updated electronics and algorithms for implant monitor and thermal conductivity characterization. The small spot size combined with rapid measurements enables full wafer mapping capabilities to 0.5mm edge exclusion, improving information turns and quality of information during process development and optimization.  

• Gate metals (W, WSi, Ru)
• Plug & Contact (W, WN, NiPt, Co)
• Barrier (Ti, TiN, Ta, TaN)
• Cu damascene metallization (seed, EP, CMP)
• Top metal (Al, TiN/Al)
• RF electrode/IDT (Mo, AlN, Pt)
• UBM, RDL (Au, Ni, TiW)

• In-line opto-acoustic measurements using femtosecond ultrafast laser
• Small spot size (8x10µm) enables measurements in a 15µm site size
• Typical thickness of metal films from 50Å to 35µm
• High throughput up to 60wph
• Intrinsic cross-fab fleet matching 

• 3µm L/S resolution with a high-fidelity projection lens and illumination system that delivers a large process window
• 250mm x 250mm square exposure field 
• ±1µm overlay capability
• ±100 ppm magnification compensation (automatic) with independent x, y magnification adjustment (Anamorphic Magnification Adjustment)
• ±400 ppm radial magnification compensation (automatic)
• Automatic compensation of die shift for superior registration to zero layer
• 6 inch square reticle format enables cost efficient reticle and lower COO

The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership. The edge-gripping handling solution for both automation platform and the inspection modules provides desired cleanliness required for wafer manufacturing. Optional high-sensitivity notch inspection can be added to the configuration. Defects detected are automatically classified and binned at run time to reduce manual operator review.

The system is designed as a multipurpose inspection and sorting system for end of line outgoing quality inspection of 300mm unpatterned wafers. The system allows for identifying, inspecting, and sorting the wafers according to freely definable recipes.