iNETest Malaysia Sdn.Bhd.

The X-Prep® is a specialized 5-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation.

It features a wizard-based, user-friendly, intuitive interface that guides the operator through a screen sequence.  As each screen appears, instruction is provided to the operator, ensuring every parameter and function is defined before operation.  Help  buttons on each screen provide access to additional explanation and instruction.  

A high-definition (720p) color camera projects a magnified, razor-sharp image of the sample onto the touch screen to help the operator define the X/Y milling/grinding/polishing boundary.  

Automatic tilt adjustment levels the sample plane parallel to the X/Y plane of the cutting tool.  Unevenly mounted or tilted samples can easily be leveled using this functionality.

A variety of fixtures and accessories are available to accommodate various sample types and sizes.

The X-Prep® Vision™ is a metrology tool that enables measurement of silicon and semitransparent substrates. It is necessary for applications that require uniform thinning to a specific target with a tolerance of +/- 3 µm or better.

The X-Prep® fixture adapter is also secured to the motorized stage on the X-Prep® Vision™, ensuring the measurement/tool control coordinates remain aligned when transferred between systems. 

A library with over 130 materials (i.e., GaAs, InGaAs, SiC, Sapphire/Al₂O₃, InP, SiGe, GaN, photo-resist) is included with every system.

Meaurement & Observation - How it Works

IR light is focused onto a sample, and a unique signal based on the refractive index of the material is created. The return signal is analyzed by the software to produce a thickness value.

Measuring Below 10 µm Thickness

For applications requiring thinning to less than 10 µm, precise measurement is possible only by adding the visible light spectrometer accessory.

Benefits:

Micro-cleaving Process:

• The SELA set of the MC20 smart micro-cleaving system with capability to register and cleave buried defects is the NEW advanced solution for the SEM sample preparation of crystalline materials with high quality, high accuracy and high throughput. The set of the MC20 comprehensive cleaving solution utilized and delivers to customers advanced capabilities of SELA’s micro-cleaving and perfect cleaving technologies.

  The MC20 table top system achieves semi-automatic, reliable and rapid cross-sectioning of wafer segments and dies. Dedicated software enables the accurate positioning control and alignment of the cleaving elements. Cleaved samples are ready for immediate inspection and analysis. The MC20 features, together with high throughput (single minute per sample), high accuracy (better than 5 microns) and the excellent natural lattice quality of the cross-sections produced, significantly reduce the turnaround time for both failure analysis and process monitoring.

  Features:

• Semi-automatic controllable cleaving process for visible and buried targets
• Advanced white light and IR optics
• Registration and cross-section of buried defects
• Observation from top and bottom of the sample
• Microscope with variable magnification up to x1000
• Built-in vacuum
• Edge cleaving – as close as 2 mm (nominal) to wafer edge
• Edge cleaving -as close as 2 mm (nominal) to sample edge
• High throughput without artifacts
• Single die capability
• Maintenance free servicing model
• Turnaround time drastically reduced
• Improves yield analysis
• Improves characterization
• Improves and enhances SEM & FIB utilization
• Improves characterization
• Low Cost of Ownership
• Minimum input sample: 4 x 2 mm
• Accuracy: Better than 5 μm, 2-3 μm with advanced optics
• Throughput: Single minute / sample

The SELA set of the MC10i smart micro-cleaving system with capability of liquid nitrogen spraying during cleaving is the NEW advanced solution for the SEM sample preparation of crystalline materials with high quality, high accuracy and high throughput. Unique LN2 spraying capability ensures best quality of the cross-section by elimination of pulling out of metals and other materials during cleaving.

The set of the MC10i delivers to customers comprehensive cleaving solution with advanced capabilities of SELA’s micro-cleaving and perfect cleaving technologies.

The MC10i table top system achieves semi-automatic, reliable and rapid cross-sectioning of wafer segments and dies. Dedicated software enables the accurate positioning control and alignment of the cleaving elements. Cleaved samples are ready for immediate inspection and analysis.

Features:

• Semi-automatic cleaving process
• Controllable liquid nitrogen spraying during cleaving
• Edge cleaving – as close as 1 mm (nominal) to wafer edge
• Edge cleaving – as close as 0.5 mm (nominal) to sample edge
• Single die capability
• High throughput without artifacts
• Microscope with variable magnification up to x1000
• Built-in vacuum
• Maintenance free servicing model
• Turnaround time drastically reduced
• Improves yield analysis
• Improves characterization
• Improves and enhances SEM & FIB utilization Improves characterization
• Low Cost of Ownership
• Minimum input sample size: 2×1 mm
• Accuracy: Better than 5 µm, 2-3 µm with advanced optics
• Throughput: Single minute / sample

A subsidiary of Ellipsiz, Axis-Tec utilises cutting-edge precision engineering technologies to design, engineer and machine complex components that adhere to the highest quality standards and lowest technical tolerance for global clients in the electronics, manufacturing, semiconductor, aerospace and oil & gas industries.

Axis-Tec provides full stack solution dealing with test automation consultancy, best practice manufacturing and assembly processes and advance technology to enhance the quality of application to customer’s product development, from the stage of R&D and into final product manufacturing and final testing.

To learn more about our about our Axis Tec solutions, click here to learn more.

STEK was established in 2014 and is focused on the research and development of photolithography mask/reticle inspection tools used mainly in the detection of defects on semiconductor wafers. STEK also specialises in customised solutions for quality and productivity enhancement.

To learn more about our STEK solutions, click here to learn more.