Precitec 3D Metrology

12” wafers inspected in single scan

The FSS 310 uniquely combines OCT with wide field-of-view scanning and solves the issue of ultra-precise measuring systems normally working very slowly and being extremely expensive. This scanner’s flexible and fast-moving measurement point within a wide field of view enables non-contact ROI inspection in much reduced cycle times – with no comprises on accuracy. Thanks to its huge scan area of 310 mm, the FSS 310 will measure the total thickness variation (TTV), bow and warp of an entire 12-inch wafer and detect any voids in a single scan – and do it in as little as 10 seconds per wafer for standard applications.

Productivity boosted

The FSS 310 can significantly boost productivity in semiconductor production by enabling a throughput of over 300 wafers per hour (including handling time). The key to such speed is the FSS 310’s in-built scanning system which allows the long paths of linear axes to be replaced by short rotary movements. This significantly reduces measuring times and does away with the need for a precision axis.

Easily integrated into production environments

In combination with Precitec’s CHRocodile® 2 IT optical sensor, the FSS 310 forms a standalone package that is easily integrated into offline or inline applications. As no additional axis or precision hardware is needed, the integration of an FSS 310 into an inline system will not result in any interruption in production. A single connection to the CHRocodile® 2 IT controller is all that is needed to conduct a customized scan procedure with the FSS 310. Applications can be easily set up thanks to the scanner’s multiple software interfaces and tools. The list of defined measurement tasks is stored in the optical sensor, which also controls the probe.

Ultra-flexible inline wafer inspection

One big advantage of the FSS 310 is that it allows measurements from just one side of a wafer. This scanner penetrates all the commonly used semiconductor materials (apart from metal) and can even measure objects behind or on the rear side of a wafer. This flexibility is also evident in the broad range of applications the FSS 310 is suitable for. When combined with devices from the Precitec CHRocodile® 2 IT family, the FSS 310’s fully variable scan trajectories, which the user can program, enable thickness and distance measurements of, for example, Si, doped Si, GaAs and SiC wafers. The FSS 310 can also measure the thickness of semiconductor component coatings (e.g. partial foliation of wafers) as well as measuring the bow of individual dies on wafers prior to further processing. All in all, the qualities of the new FSS 310 add up to a silent revolution in the world of semiconductor metrology.