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Polytec South-East Asia Pte Ltd

Singapore,  Singapore 
Singapore
http://www.polytec.com
  • Booth: C115

Stop by our booth and you will be surprise what we can offer

Overview

Polytec has been bringing light into the darkness for more than 50 years. With nearly 500 employees worldwide we develop, produce and distribute optical measurement technology solutions for research and industry. Our quality innovative products have an excellent reputation internationally among the expert community. We find solutions tailored to our customers’ requirements. 

Since its foundation in 1967, Polytec has grown into an international high-tech company. Our headquarters are located in Baden-Württemberg, Germany. In addition, we maintain subsidiaries in the USA, England, France, Japan, Singapore and China. 

In Polytec South-East Asia Pte Ltd, we specialize in the technological fields of

  • Vibrometry 
  • Velocimetry
  • 3D Surface Metrology

Inspired by the rapid further development of microelectromechanical systems and MEMS, Polytec presents this highly innovative product line of microscope-based measurement systems. MSA Micro System Analyzers from Polytec validate dynamics and topography of microsystems reliably with utmost precision. Determine transfer functions, use unique all-in-one instruments for both the static and dynamic 3D characterization of microsystems, measure and see through Si encapsulations and integrate your test-setup into (vacuum) probe stations.

For the very 1st time, showcasing in this region the MSA-650 IRIS, without need for preparing nor decapping the device. Measuring through intact silicon caps on encapsulated microstructures like e.g. inertial sensors, MEMS microphones, pressure sensors and more.

The MSA-600-S is the specialized optical measurement workstation designed for 6 GHz real-time vibration analysis and surface topography analysis. Ideal for testing GHz MEMS like FBAR (film bulk acoustic resonators), BAW (bulk acoustic wave) filters and SAW (surface acoustic wave), and other GHz resonators and devices.

TopMap Micro.View® uses Coherence Scanning Interferometry (CSI), powered with Polytec’s powerful Correlogram Technology delivers the most detailed analysis of surface roughness, texture and microstructure topography. CSI is an interesting technology to deploy to help measure and to help characterize some of the physical dimensions of a MEMS device.

  Press Releases

  • Dynamic characterization of MEMS devices to measure and visualize mechanical response is important for product development, trouble shooting and FE model validation. The MSA Micro System Analyzers from Polytec provide fast, accurate optical measurements of out-of-plane (OOP) and in-plane motion (IP). Until now, this has been limited to unpacked devices that are optically accessible. Now, the Polytec MSA-650 IRIS Micro System Anlayzer allows even measuring through intact silicon caps on encapsulated microstructres like e.g. intertial sensors, MEMS microphones, pressure sensors and more.

  Products

  • MSA-650 IRIS
    Optical characterization of dynamics inside Si-capped MEMS. MSA-650 IRIS Micro System Analyzer allows even measuring through intact silicon caps on encapsulated microstructres like e.g. intertial sensors, MEMS microphones, pressure sensors and more....

    • Laser Doppler vibrometry (LDV) is a well-established technique to study the mechanical dynamics of MEMS with utmost precision. Most laser vibrometers work at visible wavelengths for which the silicon encapsulation is opaque and inhibits MEMS inspection. Thus, LDV testing of such MEMS via visible wavelengths requires either un-encapsulated MEMS or decapping the device.

    However, the step of MEMS capping in fabrication processes may result in additional stress, which might alter the device performance. Therefore, a comprehensive characterization of the MEMS device in its final and encapsulated state is indispensable. As silicon is transparent in the near infrared spectrum above wavelengths of 1050 nm, the underlying technology of infrared-interferometer-based vibration measurement opens up the possibility for inspecting of encapsulated MEMS for authentic and most representative analysis results.

    Polytec‘s brand new, patented state-of-the-art interferometer technology now delivers supreme data quality due to superior separation of individual device layers in the si-capped MEMS devices. With a dedicated SWIR camera and a low-coherence SLD source the MSA-650 IRIS is the worldwide first measurement system with this patented technology to visualize the si-encapsulated devices.

    Measure in-plane vibration with down to 30 nm resolution and real-time out-of-plane vibrations up to 25 MHz with picometer resolution and below.

  • TMS-2400+ Compact
    Small footprint with expanded capability!
    Compact optical profiler, with an extended 100 mm Z measurement range.
    Micro.View is the cost-effective quality control instrument for inspecting precision engineered surfaces in both manufacturing and research.

    ...

    • TopMap Micro.View® is an easy to use and compact optical profiler. Combine exceptional performance
    and affordability with this powerful metrology solution. This white-light interferometer with an extended 100
    mm z measurement range with Continuous Scanning Technology (CST) allows complex topographies to be
    measured at nm resolution. This convenient table-top setup features integrated electronics, with the smart
    focus finder simplifying and speeding up the measurement procedure.

    Benefit from the optional ECT Environmental Compensation Technology, enabling reliable and accurate measurement
    results even in noisy and challenging production environments. Micro.View® is the cost-effective quality
    control instrument for inspecting precision engineered surfaces in the field of manufacturing and research.

    TopMap Micro.View® uses Coherence Scanning Interferometry (CSI), is a non-contact measurement technique.
    Non-contacts measurements are important for the measurement of free standing MEMS devices as they do not touch,
    damage or change the shape of a small free standing object or structure.

    Depending on the device of interest, it can monitor Etch/Time rates, check free standing devices, evaluate anchor points,
    check that devices are correctly shape, size or thickness, warpage measurement, step height, membrane measurement and many more.

Categories

205 Equipment, Nanotechnology
  • Equipment, Nanotechnology
    • 206 PV Equipment
  • Inspection and Metrology
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