Features
Auto overlay & CD analysis
Wide range for film thickness
Adapt to Si, GaAs, SiC, glass wafer
Merge 3D function for step height analysis
Specifications
Robot handler, Pre-aligner, OCR, Secs/Gem
Film range: upper than 30um, option
Image Resolution/FOV: 0.11 μm/ 0.22 mm x 0.12 mm @50X
Repeatability: better than 0.020um (include TIS error)
Pattern: Box In Box, Bar to Bar, customized
Data output: X/Y- shift, X/Y-Mag, X/Y- Rot, Shot Mag/Rot
Applications
5G, RF, Fingerprint Recognition, Power device
Follow up Stepper or Aligner