Semco Engineering Pte Ltd

High precision semiconductor processing combined with industrial process control, integration modularity, and a user-friendly interface. Each populated chamber can be independently configured and operated in a large range of atmospheric, sub-atmospheric or low pressure processes. The TubeStar furnace can also handle multiple gases and liquid precursors with a temperature range from 200 to 1300°C. Its modular design allows to meet a large range of clean thermal treatment for universities, research laboratories, or small production facilities.
TS150-XT: up to 150mm wafer size
TS200-XT: up to 200mm wafer size

X = chamber/level qty from 1 to 4

The MEMSLAB is designed and built with high precision components, which allows for high quality thin film deposition. The applied Low Frequency Plasma feature permits the furnace to reach excellent process performance through a most advantageous horizontal thin substrate processing. This platform excels in the processing of small quantities of substrates; therefore, allowing the MEMSLAB to meet requirements of universities, research laboratories, or small production facilities.
MEMSLAB-UNO
MEMSLAB-SIA
MEMSLAB-DUO
MEMSLAB-TRIO
MEMSLAB-SIA2
MEMSLAB-QUATRO

High performance temperature treatment combined with industrial process control, integration modularity, and a user-friendly interface. The applied heating technology alloys very fast heat rate for best uniform sheet resistance and shorter cycle times. The ACTISTAR furnace can also handle multiple gases with a temperature range from 200 to 2050°C. Its modular design allows to meet a large range of clean thermal treatment for R&D and Pilot production facilities.

AS150: up to 150mm wafer size

AS200: up to 200mm wafer size

High performance temperature treatment combined with industrial process control, integration modularity, and a user-friendly interface. The applied heating and technology and chamber design alloys best clean oxyde performance. The ACTISTAR furnace can also handle multiple gases from 850 mbar to atmospheric pressure with a temperature range from 200 to 1500°C. Its flexible design allows to meet a large range of clean & safe thermal treatment for R&D and Pilot production facilities.

OS150: up to 150mm wafer size

OS200: up to 200mm wafer size