Designed to be flexible enough to perform 6 sided vision inspections on 6” and 8” wafer,
including 12” wafer with a conversion kit, its coverage of commonly used wafer formats makes
it an ideal inspection solution for the industry.
Features:
- UPH up to 20K
- Support multiple die inspection per grab and sort wafer die by bin code
- Built-in cosmetic inspection with 6S vision inspection (Top, Bottom, 4 Sides)
- Multiple EMap file format extensions available (.A, .STIF, .ANAM)
- Wide range of die size viability
- Die size - Min: 0.6mm x 0.6mm , Max: 5x5, Aspect Ratio <2
- Die thickness - Min: 0.1, Max 0.8
- Versatile Input:
- 6”, 8” and 12” (with a conversion kit)
- Auto Panel & Unit Alignment (with 3 Reference Point)
- Support wafer input starting point from last stop location
- Versatile Output:
- 6”, 8” (with a conversion kit) or Tape & Reel
- Auto XY-axis correction to improve output unit placement accuracy